Directional Light-Emitting Sensor Packaging With Shielded Optical Channel
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Light-emitting photosensitive sensors in electronic device packaging lack directionality, making it difficult to achieve selective light emission and reception, which is essential for miniaturization and integration in high-frequency communication systems.
Innovation Solution
A manufacturing method involving a package substrate with a light-shield frame and a light transmission channel is used to create a directional light-emitting photosensitive sensor structure, where a light-emitting photosensitive sensor is electrically connected and encapsulated with a transparent packaging material, and a light-shield layer is applied to ensure light transmission only through the designated channel, providing a fixed light emitting and receiving direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent material is provided on the light-emitting photosensitive sensor to form a package, then the sensor is protected and encapsulated, but the photosensitive luminescence direction becomes difficult to control and directionality is lost
Solution Approach 1:
The light-shield frame is divided into multiple light-shielding portions that segment the cavity space, creating distinct light transmission paths. This segmentation allows the light to be directed only through specific channels while blocking other directions, thus maintaining directionality while providing protection through the transparent packaging material.
Solution Approach 2:
The light-shield frame acts as an intermediary element between the light-emitting photosensitive sensor and the external environment. It provides the necessary light direction control through its structured shielding portions, while the transparent packaging material provides protection. The intermediary light-shield frame resolves the conflict between protection and direction control.
2Reliability
If metal wires are used as transmission medium for data signals, then electrical signal transmission is achieved, but the wires are vulnerable to electromagnetic interference and require additional shielding measures
Solution Approach 1:
The patent replaces the electrical signal transmission system (metal wires) with an optical signal transmission system (light transmission channel). Optical signals are inherently immune to electromagnetic interference, thus eliminating the need for additional shielding measures while maintaining reliable signal transmission. This substitution resolves the technical contradiction between signal transmission reliability and electromagnetic interference susceptibility.
3Reliability
If optical signals are used to replace electrical signals for signal transmission, then electromagnetic interference is reduced and signal transmission quality is improved, but the light-emitting photosensitive sensor lacks directionality
Solution Approach 1:
The light-shield frame is divided into multiple light-shielding portions that segment the cavity space, creating distinct light transmission paths. This segmentation allows the light to be directed only through specific channels while blocking other directions, thus maintaining directionality while providing protection through the transparent packaging material.
Solution Approach 2:
The light-shield frame provides different properties in different locations: it is transparent or open in the light transmission channel area to allow light passage, and opaque or shielding in other areas to block light. This local quality differentiation enables directional light transmission while maintaining overall sensor protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the light-emitting photosensitive sensor to emit and receive light selectively along the light transmission channel, enhancing light directionality and reducing electromagnetic interference, thus improving signal transmission quality and miniaturization in electronic devices.
Implementation Method 1
a light-shield frame... a light-shield layer provided on the transparent packaging layer such that the light-emitting photosensitive sensor structure has a selective light-emitting and light-receiving direction along the light transmission channel
Implementation Method 2
filling the cavity and the light transmission channel with a transparent packaging material to form a transparent packaging layer on the light-emitting photosensitive sensor
Implementation Method 3
light-emitting photosensitive sensor... for optical communication
Data Source
AI summary
A method for manufacturing a light-emitting photosensitive sensor structure includes preparing a package substrate, wherein the package substrate has a cavity formed by a light-shield frame performing enclosing, and the bottom of the cavity is provided with a first line layer, forming a light transmission channel on the light-shield frame, mounting a light-emitting photosensitive sensor in the cavity of the package substrate so that the photosensitive luminescent device is electrically connected to the first line layer, filling the cavity and the light transmission channel with a transparent encapsulating material to form a transparent packaging layer on the photosensitive luminescent device, forming a light-shield layer on the transparent packaging layer, and performing cutting along a cutting line of the light-shield frame to obtain a light-emitting photosensitive sensor structure having a directional light transmission channel.