Disabling Defective Flash Memory Dies in Multi-Die Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In flash memory manufacturing, a significant portion of defective dies in multi-die packages are discarded, leading to financial losses and inefficiencies, as existing technologies lack effective methods to disable and reutilize defective dies without complex error detection and correction mechanisms.
Innovation Solution
Implementing a disabling mechanism at the die, package, or board level to identify and disable defective flash memory dies, allowing the remaining functional dies to operate within standard capacity values, thereby enabling the sale or reuse of flash memory devices with reduced storage capacity, thus mitigating financial risks and promoting the use of multi-die packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex error detection and correction mechanisms are implemented to compensate for defective dies, then data integrity is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent segments the multi-die package into individually addressable units, allowing selective disabling of defective dies while maintaining functionality of good dies. This segmentation enables granular control at the die level rather than treating the entire package as a single unit, resolving the contradiction by allowing simple disabling mechanisms rather than complex error correction systems.
Solution Approach 2:
The patent recovers value from defective dies by selectively disabling only the defective portions while retaining and utilizing the functional dies in the same package. This recovery approach avoids the need for complex error correction by simply isolating and discarding the defective segments, thereby maintaining data integrity through selective exclusion rather than active correction.
2Reliability
If entire packages are discarded when individual dies have defects, then data integrity is maintained, but manufacturing efficiency and revenue are reduced
Solution Approach 1:
The patent enables identification and independent control of individual dies within a multi-die package, allowing the system to segment the package functionality. This segmentation permits selective operation of only the functional dies, thereby maintaining data integrity while preserving manufacturing efficiency by utilizing available good dies rather than discarding the entire package.
Solution Approach 2:
The patent recovers manufacturing value by disabling only the defective dies and continuing to utilize the functional dies in the same package. This selective discarding and recovery approach maintains data integrity through proper isolation of defective units while significantly improving productivity by converting previously unusable packages into usable storage devices.
3Productivity
If selective disabling of individual dies is implemented, then resource utilization is improved, but device complexity increases
Solution Approach 1:
The patent implements preliminary action by pre-configuring each die with unique identification and pre-establishing disabling capabilities before the dies are assembled into a package. This preliminary preparation enables simple selective disabling operations during manufacturing or operation without requiring complex real-time control mechanisms, thereby improving resource utilization while maintaining device simplicity.
Data Source
AI summary
Articles and associated methods and systems relate to disabling defective flash memory dies in a device containing multiple flash memory dies. Packages containing multiple flash memory dies may be labeled to indicate a flash memory data storage capacity based on the flash memory dies that are not disabled. Various disabling methods may be applied at the die level, package level, and/or board level.