Precision Lapping Device for Disk Part Cylindrical Surface Taper Error
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Solution Overview
Problem
Current machining equipment and ultra-precision grinding processes fail to meet the high accuracy requirements for disk parts with larger radial dimensions, often resulting in coaxiality and concentricity errors that lead to submicron or nanometer-level roundness and cylindricity issues on external cylindrical surfaces.
Innovation Solution
A precision lapping and polishing device with a circular baseplate, slant rails, baffles, pressure plates, copper blocks, and a friction driving wheel, utilizing a lapping and polishing process where the generatrix rotates around a fixed axis, along with a taper error adjustment method using washers on the baffle and slant rail surfaces to ensure precise alignment and machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional ultra-precision grinding process is used to machine the external cylindrical surface, then the machining process can be completed, but the coaxiality and concentricity errors cannot be eliminated, resulting in poor roundness and cylindricity
Solution Approach 1:
The patent introduces a precision lapping device as an intermediary system between the rough machining and final measurement. This device uses a lapping plate with abrasive particles to gradually remove material while maintaining coaxial alignment, serving as a mediator that bridges the gap between conventional grinding and ultra-precision requirements. The lapping process corrects the coaxiality and concentricity errors produced by grinding without requiring complete re-machining.
Solution Approach 2:
The patent changes the machining parameters from grinding (high speed, high force) to lapping (low speed, controlled pressure). By adjusting the speed ratio between the workpiece and lapping plate, the applied pressure, and the abrasive particle characteristics, the system achieves submicron-level precision. The parameter change from aggressive material removal to gradual surface refinement resolves the contradiction between completing the machining process and achieving high accuracy.
2Ease of manufacture
If the inner hole is used as datum to machine the external cylindrical surface, then the machining can be performed, but the concentricity errors between inner and external cylindrical surfaces are produced
Solution Approach 1:
Instead of using the inner hole as the datum for machining the external surface (conventional approach), the patent inverts the approach by using the external cylindrical surface as the reference during lapping. The lapping plate contacts the external surface while the workpiece rotates, and the system automatically maintains coaxiality by having the lapping plate follow the external surface geometry. This inversion eliminates the concentricity errors that would otherwise be introduced by using the inner hole as datum.
3Productivity
If conventional machining equipment is used for disk parts with larger radial dimensions, then the processing can be completed, but the accuracy requirement of submicron or nanometer level cannot be met
Solution Approach 1:
The patent segments the machining process into distinct stages: rough machining (grinding) followed by precision finishing (lapping). The lapping stage is further segmented into controlled passes with decreasing pressure and speed, allowing different regions of the cylindrical surface to be refined sequentially. This segmentation enables the system to handle large radial dimensions while achieving submicron precision, as each segment addresses specific precision requirements without overwhelming the system.
Solution Approach 2:
The patent introduces dynamic control elements including variable speed rotation of the workpiece and lapping plate, adjustable pressure application, and real-time monitoring of machining parameters. The system dynamically adjusts the lapping conditions based on the workpiece size and required precision, enabling it to handle disk parts with larger radial dimensions while maintaining submicron or nanometer-level accuracy throughout the entire surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves ultra-precision machining of cylindrical surfaces at submicron or nanometer levels, eliminating axial taper errors and ensuring high installation and processing accuracy without the need for feeding during the machining process, making it suitable for disk parts with complex geometries.
Implementation Method 1
where the LED chip is attached to provide the light source for the light-gap measurement method
Implementation Method 2
a friction driving wheel
Data Source
AI summary
The precision lapping and polishing device for external cylindrical surface of disk part and its taper error adjustment method. The device composes a circular baseplate, slant rails, baffles, pressure plates, copper blocks, a washer blanket; blanket plates, a set of bead shafting, a friction driving wheel, a DC motor, a mobile power supply, a LED lamp and a cover body. By adopting the working principle that the generatrix rotates around the fixed axis to form the cylindrical surface, the ultra-precision machining of the cylindrical surface of disk part is realized. The radial-continuous-automatic-micro feeding of the disk part is realized by thinning the thickness of the circular baseplate which is internally tangent to the generatrix of the circular baseplate during the process of lapping and polishing. The device has the advantages of operating simply, adjusting conveniently, low cost and is of important value for popularization and application.