Displaceable Cleaning Device for Web Substrates
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Solution Overview
Problem
Existing processing machines face challenges in effectively cleaning substrates of varying properties and formats due to fixed cleaning device positions and suction forces, leading to inefficiencies and increased maintenance complexity, particularly in web processing machines where dust and foreign objects can affect print quality.
Innovation Solution
A cleaning device in a processing machine is designed to be displaceable between two cleaning states, allowing adjustment of its position and suction force relative to the substrate based on substrate properties and format, enabling both contactless and contact cleaning modes, and adaptable to different substrates and machine speeds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed cleaning device position and suction force are used, then the cleaning device structure is simple, but it cannot effectively clean substrates of varying properties and formats
Solution Approach 1:
The cleaning device is made displaceable between a first cleaning position (spaced apart from substrate) and a second cleaning position (in contact with substrate). The distance between the cleaning device and substrate is adjustable based on substrate properties and format, enabling adaptation to different cleaning requirements while maintaining a relatively simple overall structure.
2Reliability
If the cleaning device is in constant contact with the substrate, then cleaning effectiveness is maximized, but substrate damage risk increases
Solution Approach 1:
The cleaning device can dynamically adjust its position relative to the substrate. In the second cleaning position, it contacts the substrate for effective cleaning. In the first cleaning position, it is spaced apart to avoid damage. This dynamic positioning allows the system to achieve effective cleaning while minimizing substrate damage risk.
3Ease of repair
If the cleaning device is fixed in position, then maintenance is simpler, but accessibility for maintenance is reduced
Solution Approach 1:
The displaceable cleaning device can be moved to a maintenance position where it is accessible for service. The displacement mechanism allows maintenance personnel to access the cleaning device components more easily while maintaining a relatively simple overall structure that doesn't compromise maintenance simplicity.
4Device complexity
If a single cleaning device handles all substrate types, then device quantity is reduced, but cleaning precision for specific substrates decreases
Solution Approach 1:
A single cleaning device is designed with multi-functionality to handle different substrate types and formats. The device can be displaced to different positions and adjusted to contact or be spaced apart from the substrate, enabling one device to perform multiple cleaning functions that would otherwise require multiple specialized devices.
Solution Approach 2:
The dynamic positioning capability allows the single cleaning device to adapt its cleaning approach for different substrate types, maintaining cleaning precision across various substrates while reducing the total number of cleaning devices required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces scrap rates, increases the variety of substrates that can be processed with a single cleaning device, decreases maintenance complexity, and lowers operating costs by allowing flexible positioning and adaptable suction power, ensuring effective cleaning and improved accessibility for maintenance.
Implementation Method 1
the cleaning device is arranged so as to be able to apply suction force onto the substrate
Data Source
AI summary
In some examples, a processing machine has at least one cleaning device for cleaning a substrate. The at least one cleaning device and the at least one substrate are able to be arranged in a first and a second cleaning state, and the substrate is arranged at a distance from the at least one cleaning device in the first cleaning state. The substrate is arranged in contact with the at least one cleaning device in the second cleaning state, and the at least one cleaning device and the substrate are arranged so as to be transferable at least from the first cleaning state into the second cleaning state. The at least one cleaning device is arranged to be adjusted from a first cleaning position in the first cleaning state into a second cleaning position in the second cleaning state.


