Electrostatic Cleaning TRIZ Cases

A hydrogen-based plasma removes metallic residue from patterned photoresist layers on semiconductor substrates.

Gas jet thins stagnant liquid film on semiconductor wafer surface to expose fine particles trapped beneath the layer.

Parallel high-pressure liquid jets clean concave and convex ophthalmic glass surfaces simultaneously using a flared stream pattern.

Megasonic cleaning system removes sawing residue without dislodging packages by using inclined jets infused with high-frequency vibrations.

Ionized fluid neutralizes static charge while suction removes particles from EUV lithography substrate stages.

A sulfonium compound mediates amine-based photoresist stripping to protect copper interconnect surfaces.

Segmented tanks and interchangeable nozzles resolve the contradiction between mobility and device complexity in HVAC maintenance.

A dry cleaning apparatus combines laser-induced shock waves and flash pulses to remove surface contaminants from semiconductor wafers.

A displaceable cleaning device adjusts its position relative to a moving substrate to enable contact or spaced cleaning modes.

Low-pressure coherent fluid jets remove soft sludge from heat exchanger tubes, reducing application time and enabling integration with recirculation systems.

Disposable applicator transfers self-adhesive cleaning agent via controlled adhesive force differential, eliminating complex dispenser waste.

An integrated exhaust and drain cup structure prevents mist bounce back while absorbing thermal expansion of synthetic resin components.

Immersed acoustic generators create streaming fluid jets to clean electronic packages, eliminating mechanical damage and reducing cleaning time.

Dual-tacky cleaning element removes roller contaminants via surface adhesion, eliminating manual shutdowns.

Pneumatic suction through tray holes holds magnetic head sliders, eliminating net contact that obstructs solvent circulation and causes retention.

Replacing complex rotational shafts, this segmented X-Y-Z arm maintains alignment accuracy while simplifying the wafer pollutant measurement structure.

A fluid contact jig applies cleaning liquid to substrates while preventing scattering.

Border fluid spray combined with gaseous medium flow resolves ink viscosity issues by reducing consumption and preventing nozzle jams.

Imidazole additives suppress tungsten corrosion while quaternary ammonium hydroxide dissolves resist films in advanced semiconductor manufacturing.

Rotatable arms with angled nozzles reduce cross-contamination and evaporation losses while maintaining washing quality.

A passivation plasma deposits a protective layer on the substrate bevel edge to prevent film accumulation during processing.

A substrate cleaning apparatus uses a closed chamber and nozzle injection to dry wafers efficiently.

A transmission member with adjustable material layers controls ultrasonic vibration intensity and direction for wafer cleaning.

Detachable processing units reduce manufacturing time and repair effort by enabling independent assembly of deposition, etching, cleaning, and drying modules.

A showerhead cleaning rack positions the component within an ultrasonic trough to leverage standing wave oscillation for pollutant removal.

Multi-axis nozzle rotation spreads cleaning action over complex geometries, capturing dry particulate contaminants in undercuts and recesses.

A contactless cleaning device uses a movable nozzle ring to generate swirling airflow, preventing particle re-deposition without compressed air contamination.

A cleaning device regulates the end position of a first adsorption rotating member to minimize clearance between sealing and second adsorption components.

Regulating hydraulic pressure and flow rate maintains descaling quality while cutting electricity consumption.

An elastomeric roller uses electromagnetic radiation to evaluate its outer surface characteristics for continuous performance assessment.

A composite nozzle uses a resin core and metallic pipe to conduct static charges.

An electrostatic chuck generates an electric field to attract particles to a sacrificial reticle surface.

An electric field generator attracts sample residue to a catcher, preventing chaotic cap rotation and uncontrolled spilling.

A curved aluminum nozzle with evenly spaced holes sprays water to clean between pleats of cartridge filters.

Radical generation via liquid UV radiation removes ions and cleans surfaces without thermal stress.

A coating film planarizes the rear surface of semiconductor wafers to compensate for scratches generated during etching treatments.

A semiconductor cleaning method uses argon bombardment and fluorine chemistry to remove oxides from contact through holes.

Inclined sound source fields direct ultrasound maxima onto semiconductor surfaces for continuous particle removal.

Atmospheric plasma discharge generates reactive species to remove polymer coatings without substrate damage or vacuum systems.

A breakaway knuckle with spring-loaded balls and inclined grooves returns the car wash arm automatically, eliminating manual bolt replacement.

Organic solvent stripping composition removes cured color resist films from substrates without damaging underlying thin film transistors.

Hydrogen addition to PECVD chemistry increases compressive stress up to 2.8 GPa, resolving transistor reliability limits.

Flowingly dispensing liquid under laminar conditions onto a barrier plate surface to achieve smooth wetting and reduce particle contamination.

Localized dispensing along a swing path removes etching residue from damascene sidewalls, improving metal interconnect quality.

A steam-ultrasonic method cleans porous metallic filters by combining thermal expansion with ultrasonic vibration to dislodge contaminants.

High energy electromagnetic radiation heats semiconductor surfaces above 1000 degrees Celsius to remove carbon contaminants.

Applying ultrasonic energy to supercritical fluids overcomes slow reaction rates by inducing cavitation, enabling uniform metal film deposition.

A segmented cleaning device removes toner from an intermediate transfer belt using upstream and downstream brush rollers.

Annular nozzle arrays direct supercritical CO2 flow to eliminate recirculation loops and reduce drying time.