Fluid Contact Jig Suppresses Mist in Substrate Cleaning
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Solution Overview
Problem
Conventional fluid processing methods for substrates like semiconductor wafers often result in excessive mist formation and fluid wastage due to inefficient fluid application and recovery, particularly in spin cleaning methods, which can damage dicing tapes and contaminate surfaces.
Innovation Solution
A processing apparatus with supply, process target body processing, and recovery means that uses a fluid contact-use jig to apply and recover fluid precisely, preventing scattering and minimizing fluid consumption by maintaining a controlled gap between the jig and the substrate, allowing only the necessary fluid to come into contact with the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a spin cleaning method is used to apply cleaning fluid to the substrate, then the cleaning fluid can be spread and shaken off efficiently, but excessive mist formation occurs and fluid is wasted
Solution Approach 1:
The invention extracts only the necessary cleaning function from the spin cleaning method by using a cleaning member that contacts only the peripheral portion of the substrate, eliminating the need for high-speed rotation and centrifugal force while maintaining cleaning effectiveness and reducing fluid waste
Solution Approach 2:
The cleaning member is designed to clean only the peripheral portion of the substrate where contamination typically accumulates, rather than applying fluid across the entire substrate surface, thereby reducing overall fluid consumption while maintaining cleaning quality
2Loss of substance
If the substrate is rotated at high speed to shake off fluid, then fluid recovery is improved, but the dicing tape attached to the substrate is damaged
Solution Approach 1:
The invention removes the high-speed rotation step entirely from the cleaning process, using a stationary cleaning member that gently contacts the substrate periphery, thereby recovering fluid without subjecting the dicing tape to damaging centrifugal forces
Solution Approach 2:
The cleaning member acts as an intermediary between the cleaning fluid and the substrate, allowing fluid application and recovery without direct high-speed mechanical action on the substrate, thus protecting the dicing tape while maintaining fluid management effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses mist formation, reduces fluid consumption, and prevents substrate damage by ensuring that only the required amount of fluid is applied and recovered, enhancing the efficiency of fluid processing without wasting the fluid.
Implementation Method 1
causing a fluid supplied from the supply means to come into contact with a process target body while preventing the fluid from being scattered
Implementation Method 2
recovery means for recovering the fluid supplied to the process target body processing means
Data Source
AI summary
The present invention relates to a processing apparatus for fluid-processing a process target body. The processing apparatus is configured to have: supply means for supplying a fluid; process target body processing means for processing the process target body by causing a fluid supplied from the supply means to come into contact with a process target body while preventing the fluid from being scattered; recovery means for recovering the fluid supplied to the process target body processing means; and support means for supporting the process target body processing means so as to not come into contact with the process target body.