Displaceable Vacuum Capture for Multi-Size Wafer Handling
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Solution Overview
Problem
Conventional semiconductor component handling apparatuses face limitations in handling components of different sizes due to damage risks and the need for manual modifications, and the use of gripper-type mechanisms and ejector pins increases costs and reduces vacuum table efficiency.
Innovation Solution
A component pane handling apparatus with displaceable capture elements and a position control mechanism that allows for automatic or manual adjustment to handle components of various sizes, using suction elements and rotatable displacement arms to capture and transfer film frames and other semiconductor components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If gripper-type mechanisms are used to capture and hold semiconductor components, then the components can be transferred between stations, but the components may be damaged or deformed due to undue gripping force
Solution Approach 1:
The patent replaces the mechanical gripper system with a vacuum-based suction system. Instead of using mechanical fingers that apply localized gripping force, the invention uses vacuum pressure distributed across the entire component surface to hold and transfer semiconductor components, thereby eliminating the risk of mechanical damage while maintaining transfer capability
Solution Approach 2:
The invention employs pneumatic vacuum suction to capture and hold component panes. The vacuum table creates a pressure differential that securely holds the component without mechanical contact, allowing for damage-free transfer between fabrication stations while maintaining precise positioning
2Ease of operation
If gripper-type mechanisms are used, then components can be handled, but each mechanism is typically configured for one particular size only
Solution Approach 1:
The vacuum table system serves multiple functions: it acts as both a holding surface and a transfer interface for components of various sizes. By adjusting the vacuum distribution and using movable vacuum zones, the same vacuum table can handle different component sizes without requiring separate gripper mechanisms for each size
Solution Approach 2:
The invention introduces dynamic vacuum zones that can move and adjust their position on the vacuum table. This allows the vacuum holding area to adapt to different component sizes and positions, providing versatile handling capability across multiple component dimensions using a single system
3Ease of operation
If ejector pins are used on vacuum tables to receive film frames, then transfer can occur, but manufacturing and operating costs increase
Solution Approach 1:
The invention removes the ejector pin mechanism from the vacuum table design. Instead of requiring active ejection components, the system uses controlled vacuum release and mechanical guidance features to transfer film frames, thereby simplifying the vacuum table construction and reducing manufacturing costs while maintaining transfer functionality
4Ease of operation
If ejector pins are used on vacuum tables, then film frames can be received, but gaps or openings are introduced that reduce suction capability and vacuum uniformity
Solution Approach 1:
The invention extracts and eliminates the ejector pins from the vacuum table surface. By removing these physical openings, the vacuum table maintains its continuous surface structure, ensuring uniform vacuum distribution and suction capability across the entire working area while still enabling film frame transfer through alternative mechanisms
5Ease of operation
If ejector pins are not fully retracted, then transfer can occur, but unwanted damage or defects are caused to film frames
Solution Approach 1:
By removing ejector pins entirely from the system, the invention eliminates the risk of damage caused by improperly retracted pins. The transfer function is achieved through vacuum control and mechanical guidance without any protruding elements that could contact or damage the film frame during the transfer process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and damage-free handling of components of different sizes without manual modifications, reducing operational costs and improving vacuum table efficiency by allowing seamless transfer between different stations.
Implementation Method 1
using suction elements and rotatable displacement arms to capture and transfer film frames
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
A component pane handling apparatus configured to handle, carry, capture, hold, retrieve, and/or transfer e.g. wafers or film frames or solar cell panels ("components panes") of multiple different sizes. The component pane handling apparatus includes at least one component pane capture element that can be displaced between a number of different positions, each position corresponding to a particular component pane size. Therefore, the at least one component pane capture element can be positioned to different positions for allowing handling, carrying, capturing, holding, retrieving, and/or transferring of component panes of corresponding sizes. The component pane handling apparatus also includes a position alignment mechanism configured to control and/or effectuate displacement of the at least one component pane capture element to the different positions. The component pane handling apparatus can also include at least one displacement arm coupled to the at least one component pane capture element. The displacement of the at least one component pane capture element can be effectuated by a displacement, rotation, and/or translation of at least a portion of the at least one displacement arm. A method for handling component panes (e.g., wafers or film frames or solar cell panels) of multiple sizes is also included in this disclosure.