Display Device Align Leads and Lands for Narrow-Spaced Connections
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Solution Overview
Problem
Existing display devices face challenges in reducing the spacing between film pads and board pads to enhance display quality, such as resolution and frequency, without compromising alignment and contact integrity.
Innovation Solution
The display device incorporates align leads and lands on the connection film and printed circuit board, with specific alignment and realignment methods to ensure precise overlap and contact, despite varying degrees of curvature in the connection film, using compression bonding to secure the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the spacing between film pads and board pads is reduced to increase display resolution and frequency, then display quality is improved, but alignment precision and contact integrity deteriorate
Solution Approach 1:
The connection structure is segmented into three functional parts: base leads/lands for primary electrical connection, align leads/lands for alignment reference, and pads for signal transmission. This segmentation allows each component to serve its specific function optimally, with align leads/lands providing alignment reference that compensates for the reduced spacing between functional pads.
Solution Approach 2:
Align leads and align lands serve as intermediary alignment reference structures between the film pads and board pads. These intermediary elements provide a stable reference framework that enables precise positioning even when the functional pads are closely spaced, thus maintaining alignment precision despite reduced spacing.
2Manufacturing precision
If the spacing between film pads and board pads is reduced to increase display frequency, then display performance is improved, but contact integrity deteriorates
Solution Approach 1:
The connection structure is segmented into three functional parts: base leads/lands for primary electrical connection, align leads/lands for alignment reference, and pads for signal transmission. This segmentation allows each component to serve its specific function optimally, with base leads/lands providing stable electrical connection that compensates for the reduced spacing between functional pads.
Solution Approach 2:
Different regions of the connection structure have different functional qualities: base leads/lands provide mechanical stability and primary electrical connection, align leads/lands provide alignment reference, and pads provide signal transmission. This local differentiation ensures that contact integrity is maintained at the base connection level even when functional pads are closely spaced.
3Strength
If compression bonding is used to secure the connection film and printed circuit board, then connection strength is improved, but manufacturing complexity increases
Solution Approach 1:
The align leads and align lands are designed with predetermined dimensions and configurations before the compression bonding process. The align leads extend from the base leads with specific lengths in the first and second directions, and the align lands are configured on the board with corresponding dimensions. This preliminary design of alignment structures enables automated alignment during compression bonding, reducing the need for complex post-bonding adjustment mechanisms while maintaining strong connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved alignment and contact between film and board pads, ensuring consistent performance and quality in display devices by maintaining a constant contact area, even with different film curvatures.
Implementation Method 1
the connection film is used to transmit the signal and/or the voltage from the printed circuit board to the display panel
Implementation Method 2
using compression bonding to secure the connection
Data Source
AI summary
A display device includes a film align pad disposed under a connection film connected to a display panel and including a base lead and an align lead. The base lead extends in a first direction and the align lead protrudes from the base lead in a second direction intersecting the first direction. A board align pad is disposed on a printed circuit board, is connected to the connection film, and includes a base land and an align land. The base land extends in the first direction and the align land protrudes from the base land in the second direction.