Display Backplane Vapor Chamber for CPU Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The recycling and reuse of components in portable information handling systems are challenging due to their compact and lightweight designs, which make disassembly difficult and inefficient, leading to environmental impact and resource wastage.
Innovation Solution
A modular component architecture that allows for automated assembly and disassembly, tracking of component useful life, and targeted refurbishment and recycling based on usage patterns, enabling efficient distribution and reuse of information handling system components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If portable information handling systems use compact and lightweight designs, then portability and mobility are improved, but disassembly difficulty increases making recycling inefficient
Solution Approach 1:
The patent divides the information handling system into modular components (display assembly, keyboard assembly, battery, main board) that can be independently removed and recycled. This segmentation allows efficient disassembly of compact systems without requiring complete system teardown, resolving the contradiction between compact design and recyclability.
Solution Approach 2:
The patent implements a recycling program where components are systematically recovered and reused. The modular design enables selective recovery of valuable components (display, keyboard, battery) from compact systems, making the discarding and recovering process efficient despite the systems' small size and integrated nature.
2Volume of moving object
If components are densely integrated to reduce size, then portability is improved, but recycling efficiency deteriorates
Solution Approach 1:
The patent segments densely integrated components into separable modules with standardized connection interfaces. This allows recycling facilities to efficiently separate and process individual components (display, keyboard, battery) without complex disassembly procedures, maintaining high recycling efficiency despite the original compact integration.
Solution Approach 2:
The patent employs universal connection interfaces and standardized mounting mechanisms that work across different component types. This universality enables automated or semi-automated recycling processes to handle various components efficiently, offsetting the complexity introduced by dense integration in compact designs.
3Productivity
If automated assembly and disassembly systems are implemented, then recycling efficiency is improved, but system complexity increases
Solution Approach 1:
The patent segments the recycling process into discrete steps corresponding to modular component removal. This segmentation simplifies automation by allowing each component type to be handled by dedicated mechanisms, reducing overall system complexity while maintaining high recycling efficiency.
Solution Approach 2:
The patent utilizes changes in mechanical parameters (force, position, orientation) during automated disassembly to simplify the process. By programming automated systems to follow predefined parameter sequences for component removal, the complexity of handling densely integrated components is reduced to manageable parameter adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach optimizes component reuse and recycling, reduces carbon footprint, and simplifies the recycling process while maintaining user experience, promoting a circular economy by ensuring components are reused and refurbished effectively.
Implementation Method 1
a vapor chamber (242) integrated into a backplane of the display (82)... The vapor chamber (242) provides thermal management for the processing components of the main board (102)
Implementation Method 2
The vapor chamber (242) provides thermal management for the processing components of the main board (102) by distributing and rejecting excess thermal energy
Data Source
AI summary
A portable information handling system modular hybrid architecture separates components between rotationally coupled housing portions to minimize cabling, connectors and materials, and to provide improved durability that supports recycling and reuse of the components. A display coupled in one housing portion integrates a vapor chamber in the display backplate that aligns with a main board central processing unit to dissipate thermal energy to the backplate and through the backplate to the housing.