Display Baseplate Encapsulation for Spliced Module Light Control

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Solution Overview

Problem

Existing display technologies face challenges in achieving efficient encapsulation of light emitters and drive circuits, leading to issues with light emission direction, visual quality at splicing gaps, and protection against external damage and corrosion.

Innovation Solution

A display baseplate design featuring a backplate with opposite main surfaces and side surfaces, integrated with light emitters on one main surface and an encapsulation layer that covers the light emitters and selected side surfaces, along with a mould assembly and manufacturing method for producing this baseplate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an encapsulation layer is added to cover light emitters and drive circuits, then protection against external damage and corrosion is improved, but device complexity increases

Engineering Contradiction:

Improveprotection against external damage and corrosionVSAvoidencapsulation structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The encapsulation layer is divided into multiple sub-encapsulation portions (first sub-encapsulation portion covering side surfaces, second sub-encapsulation portion covering drive circuit, third sub-encapsulation portion covering specific regions). This segmentation allows each portion to be optimized for its specific function while collectively providing comprehensive protection, resolving the contradiction between protection effectiveness and structural complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the encapsulation layer have different properties and functions. The first sub-encapsulation portion has inclined surfaces for light emission control, the second sub-encapsulation portion provides protection for the drive circuit, and the third sub-encapsulation portion covers specific regions. This local differentiation optimizes protection where needed while maintaining simplicity elsewhere.

Inventive Principle:

Principle #3Local quality

2Illumination intensity

If the encapsulation layer covers selected side surfaces with inclined surfaces, then light emission direction is controlled, but manufacturing precision requirements increase

Engineering Contradiction:

Improvelight emission direction controlVSAvoidinclined surface angle precision

Core Design Contradiction:

Illumination intensityVSManufacturing precision

Solution Approach 1:

The patent specifies a range for the included angle (greater than or equal to 85°) rather than requiring a precise single value. This parameter range approach allows for manufacturing tolerance while still achieving the desired light emission direction control, resolving the contradiction between optical performance and manufacturing feasibility.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If the backplate surfaces are made non-coplanar, then encapsulation effectiveness is improved, but device complexity increases

Engineering Contradiction:

Improveencapsulation effectivenessVSAvoidbackplate structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The backplate transitions from a planar structure to a three-dimensional structure with non-coplanar main surfaces and connected side surfaces. This dimensional change allows the encapsulation layer to conformally cover the light emitters and drive circuits on multiple surfaces, improving encapsulation effectiveness while the side surfaces provide additional protection pathways.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Ease of operation

If connection wires are disposed on side surfaces, then electrical connection is achieved, but vulnerability to external damage increases

Engineering Contradiction:

Improveelectrical connection capabilityVSAvoidvulnerability to external damage

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The connection wires disposed on side surfaces are nested within or covered by the encapsulation layer structure. The first sub-encapsulation portion covers the side surfaces where connection wires are located, providing protection to these vulnerable electrical connections while maintaining their functional accessibility.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS20250079423A1Display baseplate, mould assembly, spliced display module and display apparatus

Publication Date: 2025.03.06 BOE MLED TECH CO LTD

AI summary

Provided are a display baseplate, a mould assembly, a spliced display module, and a display apparatus. The display baseplate includes a backplate light emitters and an encapsulation layer. The backplate includes a first main surface and a second main surface that are opposite to each other, and side surfaces connected to the first main surface and the second main surface light emitters are located on the first main surface, the encapsulation layer is at least partially located on the first main surface and covers the plurality of light emitters. The spliced display module includes a splicing units, the splicing units each include a splicing frame and a display baseplate, the display baseplate is fixed on the splicing frame with the light emitters away from the splicing frame; and the splicing frames of adjacent splicing units are spliced together. The display apparatus includes a display baseplate or a spliced display module.