Display Module Binding Layout Against Static Discharge Corrosion
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Solution Overview
Problem
Static electricity generation during the formation of electronic products can lead to tip discharge and corrosion at dummy soldering pads, affecting the binding reliability of the panel and flexible circuit board, particularly in reliability tests like salt spray tests.
Innovation Solution
The implementation of insulated first soldering elements on the array substrate, which are not connected electrically to the second soldering elements on the flexible circuit board, and the use of conductive adhesive to enhance binding reliability by increasing the contact area and preventing static discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dummy soldering pads are configured on both the panel and flexible circuit board to increase binding region, then binding reliability is improved, but static electricity discharge causes tearing and corrosion at dummy soldering pad positions
Solution Approach 1:
The patent applies local quality by differentiating the electrical properties of soldering pads in different regions. Conductive soldering pads in the first binding region maintain electrical connectivity, while insulating soldering pads in the second binding region prevent static discharge. This localized differentiation allows the dummy soldering pads to serve dual purposes: increasing binding area while protecting against static electricity damage through selective insulation.
2Reliability
If conductive adhesive is used to bind panel and flexible circuit board, then electrical connection is achieved, but static electricity can still cause tip discharge at soldering pad positions
Solution Approach 1:
The patent implements local quality by creating spatially differentiated electrical characteristics in the binding region. The first binding region uses conductive soldering pads for necessary electrical connections, while the second binding region employs insulating soldering pads that prevent static discharge. This localized approach allows the conductive adhesive to provide both mechanical bonding and selective electrical connectivity, eliminating tip discharge at insulating pad positions while maintaining required electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the binding reliability between the array substrate and flexible circuit board by preventing static discharge and corrosion, ensuring stable performance in reliability tests and maintaining display quality.
Implementation Method 1
the first conductive soldering pad is electrically connected to the second conductive soldering pad through an anisotropic conductive adhesive film
Implementation Method 2
at least one first soldering element of the one or more of first soldering elements is insulated from the one or more of second soldering elements
Data Source
AI summary
A module and a substrate are provided in the present disclosure. The module includes an array substrate and a flexible circuit board. The array substrate includes a binding region including a first binding region and a second binding region; and in the binding region, the flexible circuit board is bound with the array substrate. In the first binding region, the array substrate includes a first conductive soldering pad; the flexible circuit board includes a second conductive soldering pad; and the first conductive soldering pad is electrically connected to the second conductive soldering pad. In the second binding region, the array substrate includes one or more of first soldering elements; the flexible circuit board includes one or more of second soldering elements; a first soldering element of the one or more of first soldering elements is fixed with a second soldering element of the one or more of second soldering elements.