Display Panel Blind-Hole Planarization for Under-Screen Camera Transmittance
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Solution Overview
Problem
The existing display panel technology using a double-layered yellow polyimide (YPI) substrate setup results in poor light transmittance in the camera area due to diffuse reflection caused by an uneven surface after the second-layer colorless and transparent polyimide (CPI) substrate is partially removed, which limits the development of under-screen camera technology.
Innovation Solution
A display panel design with a first yellow polyimide substrate and a second colorless transparent polyimide substrate, where the first substrate is completely removed by a laser process and the second substrate has blind holes filled with a light-transmitting planarization layer made of the same material, along with a water and oxygen barrier layer and an anti-reflection film to improve surface flatness and light transmittance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the second-layer CPI substrate is partially removed by laser process, then the light transmittance of camera area is improved, but the surface of remaining unremoved substrate becomes poorly flat causing diffuse reflection
Solution Approach 1:
A planarization layer is formed on the second substrate before the laser removal process. This preliminary action ensures that when the second substrate is partially removed, the planarization layer remains to provide a flat surface, preventing diffuse reflection while allowing high light transmittance in the camera area.
2Illumination intensity
If the first-layered YPI substrate is completely removed and second-layered CPI substrate is partially removed, then light transmittance is improved, but diffuse reflection occurs reducing light transmittance
Solution Approach 1:
The planarization layer is deposited beforehand on the second substrate to create a flat surface. This preliminary structure prevents diffuse reflection from occurring when the second substrate is partially removed by laser, thereby eliminating the harmful effect while maintaining improved light transmittance.
3Illumination intensity
If CPI substrate is used instead of YPI substrate, then optical performance is improved, but thermal stability is reduced
Solution Approach 1:
The patent uses different substrate materials in different regions: the first substrate uses YPI for thermal stability, while the second substrate uses CPI for optical performance. This local differentiation allows each layer to optimize for its specific function without compromising the other.
Solution Approach 2:
The patent employs a composite substrate structure with two different polyimide materials (YPI and CPI) stacked together. This composite approach combines the thermal stability of YPI with the optical performance of CPI, achieving both requirements simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a relatively flat film surface, reducing diffuse reflection and enhancing light transmittance by matching the material of the planarization layer with the second substrate, thereby improving the light transmittance and photographing effects.
Implementation Method 1
the first-layered YPI substrate is completely removed by a laser process, and the second-layered CPI substrate is partially removed
Data Source
AI summary
The present application discloses a display panel, a method of manufacturing the same, and a display device, wherein the display panel includes a first substrate, a second substrate, and a light-transmitting planarization layer, a light transmittance of the first substrate is lower than that of the second substrate; at least one first through hole is provided on the substrate, at least one blind hole is provided on the second substrate, and the blind hole is provided corresponding to the first through hole; the light-transmitting planarization layer is provided in the blind hole to flatten the bottom of the blind hole, thus obtaining a relatively flat film surface.