Display Unit Bonding Pad Layout for Flexible Panel Tiling
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Solution Overview
Problem
The increasing complexity of tiling patterns for large display panels leads to longer development times and higher labor costs due to the variety of circuit designs required for different contours.
Innovation Solution
A display apparatus with a non-rectangular display area, utilizing a combination of vertical-type and lateral-type light emitting devices, where the first wire bonding pad overlaps the first light emitting device and at least one second light emitting device, allowing for increased interchangeability and reduced variety in circuit designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different contour patterns are used to tile display panels into various shapes, then the adaptability of the display apparatus is improved, but the device complexity increases due to the need for multiple circuit board designs
Solution Approach 1:
The patent implements a universal circuit board design that can support multiple tiling patterns (rectangular, L-shaped, T-shaped, cross-shaped, etc.) through a standardized bonding pad arrangement. The bonding pads are positioned to overlap with light emitting devices in a way that accommodates various contour patterns without requiring different circuit board designs, thus achieving multi-functionality and reducing design variety.
Solution Approach 2:
The circuit board is segmented into functional regions with bonding pads strategically positioned to overlap with specific light emitting devices. This segmentation allows the same circuit board design to be configured for different tiling patterns by selectively activating or connecting to different bonding pads, enabling flexibility without increasing overall design complexity.
2Adaptability or versatility
If multiple circuit board designs are created to satisfy different tiling pattern requirements, then the adaptability is improved, but the productivity decreases due to longer development time and increased labor cost
Solution Approach 1:
By designing a single universal circuit board that can accommodate multiple tiling patterns through standardized bonding pad arrangements, the patent eliminates the need to develop multiple different circuit board designs. This universal design approach significantly reduces product development time and labor costs while maintaining the ability to create various tiling patterns.
Solution Approach 2:
The patent uses parameter changes in the bonding pad configuration and light emitting device arrangement to achieve different tiling patterns from the same base circuit board design. By varying the activation and connection parameters of existing bonding pads rather than changing the overall circuit board design, the system maintains high productivity while achieving pattern diversity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the variety of circuit designs, shortens development time, and lowers labor costs while maintaining a high-quality tiled display effect.
Implementation Method 1
Each of the display units includes a circuit substrate, a first light emitting device, and a plurality of second light emitting devices
Data Source
AI summary
A display apparatus includes circuit boards and display units. The display unit includes a circuit substrate, a first light emitting device, and second light emitting devices. The circuit substrate has a first wire bonding pad and second wire bonding pads. A first electrode disposed on one side of a first light emitting structure layer of the first light emitting device is wire-bonded to one second wire bonding pad, and a second electrode disposed on the other side of the first light emitting structure layer is bonded to the first wire bonding pad. Third and fourth electrodes disposed on one side of a second light emitting structure layer of the second light emitting device are respectively wire-bonded to two of the first wire bonding pad and the second wire bonding pads. The first wire bonding pad overlaps the first light emitting device and at least one second light emitting device.