Display Device Bridge Section Preventing Terminal Short Circuits
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Solution Overview
Problem
In liquid crystal display devices, organic EL display devices, and similar technologies, the issue of electrical connections between terminal sections due to incomplete etching of ITO films and conductive attachments formed during manufacturing processes leads to reliability concerns and connectivity issues with external circuits.
Innovation Solution
The implementation of a terminal section structure featuring an organic insulating film with through holes and a metal oxide conductive film, where the organic insulating film extends as a bridge between terminal sections, preventing electrical connections between adjacent terminals and ensuring reliable connections with external circuits through the use of anisotropic conductive films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the organic insulating film is formed thick to prevent electrical connection between terminals, then reliability is improved, but peeling force during substrate cutting increases
Solution Approach 1:
The organic insulating film is segmented into a main body portion and a bridge portion extending to the substrate end. The bridge portion has a width of 1-10 μm, which is sufficient to prevent conductive attachment between adjacent terminals but thin enough to reduce peeling force during substrate cutting, thus resolving the contradiction between reliability and cutting ease
Solution Approach 2:
Different portions of the organic insulating film have different widths tailored to their specific functions: the main body has a larger width for adequate insulation, while the bridge portion at the substrate end has a reduced width (1-10 μm) to minimize peeling force. This local differentiation resolves the contradiction by optimizing each region for its specific purpose
2Reliability
If the organic insulating film extends to the substrate end to prevent conductive attachment, then reliability is improved, but adhesive strength decreases
Solution Approach 1:
The organic insulating film is divided into a main body portion with larger width for insulation and a bridge portion extending to the substrate end with smaller width (1-10 μm). The bridge portion prevents conductive attachment while its reduced width and area minimize the loss of adhesive strength, thus resolving the contradiction
Solution Approach 2:
Instead of forming the organic insulating film across the entire substrate width, the film is extended only partially to the substrate end through the bridge portion. This partial extension is sufficient to prevent conductive attachment at the critical substrate end region while minimizing the total area and thus the adhesive strength loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of terminal sections by preventing unwanted electrical connections between terminals while ensuring effective electrical connections with external circuits, reducing peeling forces during substrate cutting, and maintaining adhesive strength.
Implementation Method 1
connections with external circuits through the use of anisotropic conductive films
Data Source
AI summary
Measures are taken against the problem that a conductive matter is attached to an organic film in the vicinity of terminal sections of a display device, which causes electrical connection between the terminals when the terminals are connected to a flexible wiring board. An organic passivation film is formed to the vicinity of the end of the substrate, and a conductive matter is attached to the edge of the organic passivation film. The conductive attachment is divided by extending a bridge section of the organic passivation film to the end of the substrate. Thus, even if a flexible wiring board is connected thereto, the electrical connection between the terminals can be prevented.