Integrated Display and Camera Chiplets for Thin Imaging
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Solution Overview
Problem
Existing integrated image capture and display systems suffer from reduced image quality and increased thickness due to complex structures and limited image sensing elements, which affect the resolution and sharpness of captured images.
Innovation Solution
The integration of lenses within or upon a transparent cover of the display apparatus, combined with high-level circuit integration in chiplets, allows for a compact and robust structure with improved imaging quality and reduced thickness, enabling high-resolution image capture and display.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If image sensors are located behind the display forming a thick integrated structure, then image capture and display functions are integrated, but the apparatus thickness increases and image quality deteriorates
Solution Approach 1:
The patent merges the display and image capture functions into a single integrated apparatus where the camera module and display module are positioned adjacent to each other and controlled by a single processor, creating a unified device that performs both functions without requiring separate components
Solution Approach 2:
Instead of stacking the image sensor behind the display in the thickness direction, the patent positions the camera module adjacent to the display module in the lateral direction, changing the spatial arrangement from vertical stacking to horizontal placement, thereby reducing apparatus thickness while maintaining integration
2Manufacturing precision
If digital cameras are designed with a long optical axis for higher-quality imaging, then image quality improves, but the camera thickness increases
Solution Approach 1:
The patent nests the lens assembly within a compact camera module structure where the optical components are arranged in a folded or stacked configuration, allowing a sufficiently long optical path to be achieved within a reduced thickness by utilizing three-dimensional space efficiently
Solution Approach 2:
The optical axis is oriented in a direction perpendicular to the thickness direction of the camera module, allowing the optical path to extend in the lateral direction rather than increasing the thickness, thereby achieving long optical axis benefits without thickening the camera
3Length of stationary object
If lens elements are located very close to or on imaging elements to reduce thickness, then apparatus thickness decreases, but image quality deteriorates
Solution Approach 1:
The lens is nested within the camera module at a controlled distance from the imaging sensor, with the optical path folded or redirected to achieve adequate separation between lens and sensor within a compact form factor, maintaining image quality while minimizing overall thickness
Solution Approach 2:
Instead of placing the lens directly on or very close to the imaging sensor in the thickness direction, the patent arranges the optical components so that light travels through a longer path in the lateral direction before reaching the sensor, achieving adequate optical separation without increasing thickness
4Device complexity
If fewer image sensing elements are provided to reduce complexity, then device complexity decreases, but image resolution is reduced
Solution Approach 1:
The processor controls both the display module and camera module and performs image processing functions, making the processor multi-functional and reducing the need for separate dedicated processing units for each function, thereby managing complexity while maintaining high-resolution image capture capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved imaging performance with reduced bandwidth requirements, enabling three-dimensional imaging and high-resolution captures while maintaining a mechanically robust and thin structure, enhancing both image quality and display performance.
Implementation Method 1
Light is emitted from a pixel when current passes through the light-emitting material. The frequency of the emitted light is dependent on the nature of the material used.
Implementation Method 2
One or more imaging lenses formed on or in the transparent cover, each imaging lens spaced apart from and corresponding to an image sensor array for forming an imaging plane on the corresponding image sensor array
Data Source
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AI summary
An apparatus for displaying and sensing images includes a display substrate (10) and a plurality of electroluminescent pixels (30). A plurality of pixel control chiplets (20, 20A) and one or more sensor chiplets (20, 20A, 20B) are affixed to the device side (9) of the display substrate (10) in the display area. A transparent cover (40) is spaced apart from and affixed to the device side (9) of the display substrate (10), and has a plurality of imaging lenses (42) formed on or in it, each imaging lens (42) spaced apart from and corresponding to an image sensor array (23, 23A, 23B) in a sensor chiplet (20, 20A, 20B) for forming an imaging plane on the corresponding image sensor array (23, 23A, 23B).