Display Chip Mounting Layout for Coplanar Terminal Alignment
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Solution Overview
Problem
Existing display device manufacturing methods face challenges in aligning terminals of chips with different thicknesses on the same surface, leading to complexity in the manufacturing process and potential interference between LED and circuit chips.
Innovation Solution
The method involves forming recesses or protrusions on the substrate corresponding to the heights of LED and circuit chips, allowing the terminals to be aligned on the same plane, simplifying the manufacturing process and eliminating height differences between the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If chips of different thicknesses are mounted on a flat substrate surface, then the device structure becomes simple, but the terminals cannot be aligned on the same surface leading to manufacturing complexity
Solution Approach 1:
The substrate surface is modified locally by forming recesses at specific positions where chips of different thicknesses are mounted. This local modification allows terminals to be aligned on the same surface without changing the entire substrate structure, thus maintaining overall structural simplicity while enabling precise terminal alignment for manufacturing.
Solution Approach 2:
Instead of trying to align terminals horizontally on a flat surface, the invention introduces vertical dimension changes by forming recesses in the substrate. This dimensional change allows chips of different thicknesses to be positioned such that their terminals reach the same level, solving the alignment problem through three-dimensional structural design.
2Manufacturing precision
If additional protective substrates are added to accommodate height differences, then terminal alignment is achieved, but the device thickness increases
Solution Approach 1:
The invention extracts the height compensation function from the protective substrate and integrates it directly into the substrate structure through recesses. This eliminates the need for additional protective substrates while maintaining terminal alignment, thus achieving manufacturing precision without increasing device thickness.
Solution Approach 2:
The substrate and the height compensation structure are merged into a single integrated component. The recesses are formed directly in the substrate, combining the substrate's structural support function with the height adjustment function, thereby eliminating the need for separate protective substrates and reducing overall device thickness.
3Ease of manufacture
If recesses are formed in the substrate to align terminals, then manufacturing is simplified, but the substrate structure becomes more complex
Solution Approach 1:
The substrate structure is modified by changing the depth parameter of specific regions to form recesses. This parameter change allows the substrate to accommodate chips of different thicknesses while maintaining a relatively simple overall structure. The recesses are formed only where needed, minimizing structural complexity while enabling simplified manufacturing through direct wiring connection.
Data Source
AI summary
A display device includes a substrate having a first surface and a second surface opposite the first surface, a first chip arranged on the first surface and having a first terminal forming surface on which a first terminal is arranged on an opposite side to a first mounting surface in contact with the first surface, and a second chip arranged on the first surface, having a second terminal forming surface on which a second terminal is arranged on an opposite side of a second mounting surface in contact with the first surface, and having a different thickness from the first chip, wherein an upper surface of the first terminal and an upper surface of the second terminal are located on a same surface parallel to the second surface.