Display Electrode Interconnection via Shared Contact Hole Layout

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Solution Overview

Problem

The existing methods for fabricating display devices are inefficient due to the need for multiple mask processes, which complicate the interconnection of conductive layers and reduce process efficiency.

Innovation Solution

A display device is fabricated using a method that includes a first conductive layer, a passivation layer, a second conductive layer, and a via layer, with a connection pattern that electrically connects the layers through a contact hole, eliminating the need for a separate mask process for connecting the layers, thereby improving process efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple mask processes are used to connect conductive layers, then the interconnection can be achieved, but the process complexity and manufacturing time increase

Engineering Contradiction:
Improveinterconnection reliabilityVSAvoidprocess complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the functions of multiple separate mask processes into a single integrated contact hole formation process. The contact hole simultaneously penetrates the passivation layer and via layer, and the connection pattern is formed to connect both conductive layers in one step, eliminating the need for separate masking operations while maintaining reliable electrical interconnection between layers.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The contact hole structure serves multiple functions simultaneously: it penetrates the passivation layer for electrical connection, penetrates the via layer for structural integration, and the connection pattern provides both mechanical support and electrical conductivity. This multi-functional design reduces the number of specialized processes needed.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple mask processes are used to connect conductive layers, then the interconnection can be achieved, but the manufacturing time and process steps increase

Engineering Contradiction:
Improveinterconnection reliabilityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The contact hole is formed to simultaneously expose both the first conductive layer through the passivation layer and the second conductive layer through the via layer in advance. The connection pattern is then deposited to connect both layers in a single continuous process, eliminating the need for sequential masking operations and improving manufacturing throughput.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If separate mask processes are used for connecting conductive layers, then precise alignment can be achieved, but the process cost and complexity increase

Engineering Contradiction:
Improvealignment precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The alignment function previously requiring separate mask processes is integrated into the single contact hole formation and connection pattern deposition process. The contact hole geometry and connection pattern design inherently provide the necessary alignment between the first and second conductive layers, maintaining precision while reducing process complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11894355B2Display device and method of fabricating the same
Publication Date: 2024.02.06 SAMSUNG DISPLAY CO LTD
  • US11894355B2 patent drawing
  • US11894355B2 patent drawing
  • US11894355B2 patent drawing

AI summary

A display device includes a first conductive layer disposed on a substrate, a passivation layer disposed on the first conductive layer, a second conductive layer disposed on the passivation layer, a via layer disposed on the second conductive layer, a third conductive layer disposed on the via layer, the third conductive layer including a first electrode, a second electrode, a connection pattern, the first electrode, the second electrode, and the connection pattern being spaced apart from each other, and a light emitting element, a first end and a second end of the light emitting element being disposed on the first electrode and the second electrode, respectively, wherein the connection pattern electrically connects the first conductive layer and the second conductive layer through a first contact hole penetrating the via layer and the passivation layer.