Display Cooling Assembly Using Heat-Shrink Resin Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High brightness display devices with self-luminous light emitting elements face challenges in heat dissipation, leading to reduced light emission efficiency and potential damage due to temperature rise, as conventional cooling mechanisms struggle to effectively contact and cool exposed elements without causing damage.
Innovation Solution
A display device design incorporating a substrate with light emitting elements, a heat dissipation sheet, and a cooling unit, where a heat shrinkable resin connection portion is used to securely bond the heat dissipation sheet between the substrate and cooling unit, ensuring close contact and efficient heat transfer without damaging the elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling mechanism is applied to cool the light emitting elements, then heat dissipation is improved, but the elements may be damaged due to pressing from front and back sides
Solution Approach 1:
The patent introduces a connection portion made of heat shrinkable resin as an intermediary between the cooling mechanism and the light emitting elements. This intermediary allows the cooling mechanism to be pressed against the back surface to improve thermal contact, while the heat shrinkable material protects the elements from damage by deformable bonding during the pressing process
Solution Approach 2:
The connection portion utilizes heat shrinkable resin that changes its physical parameters (shrinks and increases bonding strength) when heated. This parameter change allows the connection portion to be formed in a relaxed state initially, then shrinks upon heating to create strong bonding between the cooling mechanism and substrate without damaging the elements
2Strength
If the connection portion is made strong to ensure bonding, then adhesion is improved, but the light emitting elements may be damaged due to excessive pressing force
Solution Approach 1:
The connection portion uses heat shrinkable resin that undergoes parameter change when heated - it shrinks and increases its bonding strength. This allows the formation of strong bonds between the cooling mechanism and substrate while controlling the pressing force application timing, preventing element damage during assembly
Solution Approach 2:
The connection portion is formed by heating the heat shrinkable resin before final assembly, creating the bonding structure in advance. This preliminary action allows the bonding to be established under controlled conditions, preventing element damage during subsequent assembly operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from the light emitting elements and circuits, preventing temperature-related damage and maintaining high brightness by ensuring efficient heat transfer and adhesion between the heat dissipation sheet and substrate, thus enhancing the overall performance of the display device.
Implementation Method 1
a heat dissipation sheet located between the second main surface and the third main surface and in contact with the second main surface and the third main surface
Implementation Method 2
the connection portion is made of a heat shrinkable resin
Data Source
AI summary
A display device includes a substrate having a first main surface on which a plurality of light emitting elements spaced apart from each other are provided and a second main surface located on a side opposite to the first main surface, a cooling unit having a third main surface and a fourth main surface located on a side opposite to the third main surface, a heat dissipation sheet located between the second main surface and the third main surface and in contact with the second main surface and the third main surface, and a connection portion arranged at a position sandwiching the heat dissipation sheet in a direction along the second main surface and bonded to each of the substrate and the cooling unit, and the connection portion is made of a heat shrinkable resin.