Electronic Display Cooling via Segmented Airflow Channels
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Solution Overview
Problem
Modern electronic displays face challenges in cooling due to increased brightness, power consumption, and environmental temperature variations, leading to heat management issues, especially with larger screen sizes and varying operating conditions.
Innovation Solution
A system incorporating isolated gas cooling chambers with transparent anterior plates and external fans, along with heat dissipating assemblies and heat exchangers, to efficiently cool power modules, backlights, and front display surfaces, maintaining image quality while effectively dissipating heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans are used to move air past components for cooling, then heat transfer capability is improved, but device complexity increases
Solution Approach 1:
The cooling system is divided into separate functional zones: a first cooling zone for the backlight assembly and a second cooling zone for the display assembly. Each zone has dedicated cooling channels and airflow paths, allowing independent optimization of cooling for different components without increasing overall system complexity
Solution Approach 2:
A heat exchanger is introduced as an intermediary component between the cooling air and the electronic components. The heat exchanger transfers heat from the components to the airflow, improving cooling efficiency while keeping the cooling architecture modular and manageable
2Area of stationary object
If larger screen sizes are implemented, then display area is improved, but heat generation increases
Solution Approach 1:
Cooling channels are strategically positioned at specific locations where heat generation is highest. The first cooling channel is located near the backlight assembly while the second cooling channel is positioned for the display assembly, providing localized cooling where needed most rather than uniform cooling throughout
Solution Approach 2:
The cooling system utilizes three-dimensional airflow paths and stacked cooling channels to address heat generation in larger displays. By creating vertical and horizontal airflow patterns within the display structure, the system can cool distributed heat sources across large screen areas effectively
3Illumination intensity
If illumination devices operate at high brightness levels, then illumination intensity is improved, but power consumption and heat generation increase
Solution Approach 1:
The cooling system is designed to be activated before and during high-brightness illumination operation. Pre-cooling of the backlight assembly and display components before high-power illumination begins helps manage thermal loads, while the cooling channels remain active during operation to continuously remove heat generated by high-power illumination devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides enhanced cooling capabilities, enabling displays to operate effectively in extreme temperatures up to 113°F and maintaining performance in outdoor environments, ensuring thermal stability and extended lifespan of electronic components.
Implementation Method 1
Conductive and convective heat transfer systems for electronic displays are generally known attempt to remove heat from the electronic components in a display through as many sidewalls of the display as possible
Implementation Method 2
Power modules with heat dissipating assemblies (ex. cold plates and/or heat sinks)
Data Source
AI summary
A system for cooling an electronic display where an isolating structure may be used to allow ambient air to cool power modules. The isolating structure substantially prohibits containments which may be present within the ambient air from contacting sensitive electrical components on the power modules or otherwise. A gasket may be used to seal the interface between the power modules and the isolating structure. Heat sinks may be placed in thermal communication with the power supplies and fans may draw air through a narrow channel in which the heat sinks are located. In some embodiments the narrow channel may have the opposing surface of the channel defined by the rear portion of an LED assembly. Exemplary embodiments may use the ambient air to cool both the power modules and a closed loop of isolated gas within the electronic display.