Display Cover Layer Curing With UV Reflective Frame Structure

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Solution Overview

Problem

Existing display devices face issues with moisture penetration, leading to non-curing of cover layers at pad parts, which compromises the moisture-proof properties.

Innovation Solution

A display device design incorporating a first reflective layer with a multi-layered structure of high and low refractive index layers, protrusion structures, and a UV-curable cover layer, along with a frame and printed circuit board configuration, to enhance moisture resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cover layer is applied to the pad part, then moisture proof properties are improved, but non-curing occurs leading to weakened delamination force

Engineering Contradiction:
Improvemoisture proof propertiesVSAvoiddelamination force
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The pad part is divided into a first pad part and a second pad part, with the first pad part having a larger area than the second pad part. The cover layer is applied selectively to different regions, allowing the first pad part to provide strong delamination force while the second pad part provides moisture protection, resolving the contradiction between curing completeness and moisture proofing.

Inventive Principle:
Principle #1Segmentation

2Strength

If UV light is applied to cure the cover layer, then bonding strength is improved, but non-curing occurs in certain areas leading to moisture permeation

Engineering Contradiction:
Improvebonding strengthVSAvoidmoisture permeation
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The pad part is divided into regions with different cover layer thicknesses and UV light transmission characteristics. The first pad part has properties optimized for strong bonding and moisture protection, while the second pad part has properties optimized for UV light transmission to ensure complete curing, thereby preventing moisture permeation while maintaining bonding strength.

Inventive Principle:
Principle #3Local quality

3Reliability

If the cover layer is made thicker to improve moisture protection, then moisture proof properties are enhanced, but UV light penetration is reduced causing non-curing

Engineering Contradiction:
Improvemoisture proof propertiesVSAvoidcuring completeness
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The cover layer is segmented into different thickness regions: a first cover layer with greater thickness applied to the first pad part for superior moisture protection, and a second cover layer with lesser thickness applied to the second pad part to ensure adequate UV light penetration and complete curing, thus resolving the contradiction between moisture protection and curing completeness.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents non-curing of cover layers, thereby improving the moisture-proof properties of the display device and ensuring reliable operation.

Implementation Method 1

A first reflective layer disposed on a surface of the frame and disposed between the frame and the cover layer

Methodology Applied
Scientific EffectUV light reflection: Reflection

Implementation Method 2

a cover layer disposed between the substrate and the frame and overlapping the printed circuit board in a plan view... the cover layer may include an ultraviolet (UV)-curable material

Methodology Applied
Scientific EffectUV curing: Photopolymerisation

Data Source

PatentUS12610861B2Display device and method of manufacturing the same
Publication Date: 2026.04.21 SAMSUNG DISPLAY CO LTD
  • US12610861B2 patent drawing
  • US12610861B2 patent drawing
  • US12610861B2 patent drawing

AI summary

A display device includes a printed circuit board attached to a side of a substrate, a frame facing the printed circuit board, a cover layer disposed between the substrate and the frame and overlapping the printed circuit board in a plan view, and a first reflective layer disposed on a surface of the frame and disposed between the frame and the cover layer.