Display Device Heat Dissipation Metal Layers
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Solution Overview
Problem
High temperatures generated by the driver IC in organic EL display devices can lead to premature deterioration of self-light-emitting elements, reducing their lifespan.
Innovation Solution
A display device design featuring a first metal layer covering the display area and a second metal layer positioned near the driver IC, with a space between them, to dissipate and equalize heat generated by the driver IC, preventing heat transmission to the self-light-emitting elements. The metal layers are formed using high heat conductivity materials like Al or Cu and covered with an insulating protective layer to prevent peeling and corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat equalizing means is provided on both front and reverse surfaces, then heat dissipation is improved, but device structure becomes more complex
Solution Approach 1:
The patent primarily implements the heat equalizing means on the reverse surface of the element substrate, utilizing the z-dimension (thickness direction) for heat dissipation. By focusing the heat equalizing structure on one surface rather than both, the patent achieves effective heat management while reducing structural complexity compared to dual-surface implementations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents the adverse effects of high temperatures on self-light-emitting elements, enhancing their lifespan by facilitating heat dissipation and dispersion, thereby maintaining the display device's performance.
Implementation Method 1
a first metal layer is disposed on the reverse side of a position serving as the display area in the element substrate, and a second metal layer is disposed with a space between the first metal layer and the second metal layer on the reverse side of a position where the driver IC is disposed in the element substrate
Data Source
AI summary
A display device includes an element substrate including a display area where a plurality of self-light-emitting elements are formed, and a driver IC disposed outside the display area in the element substrate. A first metal layer is disposed on the reverse side of the element substrate at a position opposite to the display area. A second metal layer is disposed with a space between the first metal layer and the second metal layer on the reverse side of the element substrate at a position opposite to the driver IC.