Display Device Thinned Substrate Through Hole Connection
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Solution Overview
Problem
Conventional display devices with a driver mounted peripherally on the substrate face challenges in achieving a thinner bezel structure and increased display area due to the need for flexible printed circuits, which can lead to space constraints and reliability issues.
Innovation Solution
The display device employs a structure with an insulating substrate having a thinner second area with a pad electrode and conductive material inside a through hole to connect the pad electrode with a signal line, using an anisotropy conductive film for electrical connection, eliminating the need for a flexible printed circuit and allowing for a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a flexible printed circuit is used to connect the driver to the substrate, then electrical connection is achieved, but the bezel thickness increases and display area decreases
Solution Approach 1:
The patent extracts and eliminates the flexible printed circuit from the system by establishing direct electrical connection between the driver and substrate through contact holes, thereby removing the component that occupies bezel space and limits display area expansion
Solution Approach 2:
The patent transitions from a planar connection approach using flexible circuits to a vertical through-substrate connection approach using contact holes, utilizing the thickness dimension of the substrate to achieve electrical connection without expanding the lateral bezel structure
2Reliability
If a flexible printed circuit is used for electrical connection, then the driver can be mounted peripherally, but reliability issues arise due to space constraints
Solution Approach 1:
By removing the flexible printed circuit from the system and replacing it with direct substrate contact, the patent eliminates the reliability issues associated with flexible circuit space constraints while maintaining electrical connection functionality
Solution Approach 2:
The contact hole acts as an intermediary structure that enables direct electrical connection between the driver and substrate, replacing the flexible printed circuit mediator and providing a more reliable connection path
3Area of stationary object
If the insulating substrate is made uniformly thin to increase display area, then manufacturing precision is compromised due to the need for through holes
Solution Approach 1:
The patent applies local quality by creating a thickness difference in the insulating substrate, making the second area thinner than the first area, and positioning through holes specifically in the thinner region to facilitate easier hole formation while maintaining overall substrate integrity
Solution Approach 2:
The insulating substrate is segmented into regions of different thicknesses, with the first area maintaining original thickness for structural support and the second area thinned for through hole formation, allowing simultaneous achievement of display area expansion and manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a compact, thin-bezel display device with an increased display area, improved reliability by avoiding flexible printed circuit-related issues and allowing for miniaturization of electronic devices.
Implementation Method 1
a conductive material disposed inside the first through hole to electrically connect the pad electrode and the connection line
Data Source
AI summary
According to one embodiment, a display device includes an insulating substrate including a first area and a second area adjacent to the first area, the insulating substrate including a first through hole formed in the second area which is formed thinner than the first area, a pad electrode disposed above the first through hole, a signal line electrically connected to the pad electrode, a line substrate including a connection line and disposed below the insulating substrate, a conductive material disposed inside the first through hole to electrically connect the pad electrode and the connection line, a first protection member disposed below the first area, and a second protection member disposed below the first protection member.