Display Drive Grounding Structure Using a Thick Connection Pattern
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Solution Overview
Problem
Existing display devices face challenges in stably connecting the ground of the drive portion, which can lead to instability and potential degradation due to static electricity.
Innovation Solution
A drive portion design featuring a flexible circuit film, a circuit board, a protective film, and a connection pattern that ensures the ground pad portion of the circuit board is electrically connected to the ground layer of the protective film, with the connection pattern thickness equal to or greater than the combined thickness of the protection and insulating layers, facilitating stable grounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional connection structure is used between the circuit board and protective film, then the device complexity is reduced, but the reliability of ground connection deteriorates due to potential electrical disconnection and static electricity damage
Solution Approach 1:
The connection pattern extends in the thickness dimension (Z-axis) to penetrate through both the protective film and insulating layer, establishing electrical connection in the vertical dimension rather than relying solely on planar contact. This dimensional approach ensures reliable ground connection by creating a through-path that maintains electrical continuity regardless of lateral misalignments or contact pressure variations.
Solution Approach 2:
The connection pattern serves as an intermediary conductive element that bridges the ground pad on the circuit board and the ground layer on the protective film. By introducing this intermediate conductive structure that traverses through the insulating layers, the patent establishes a reliable electrical pathway without requiring direct contact between the ground pad and ground layer, thus improving connection stability.
2Reliability
If the connection pattern thickness is increased to ensure stable ground connection, then the reliability improves, but the manufacturing precision requirements increase due to the need to penetrate through multiple layers
Solution Approach 1:
The connection pattern is designed with excessive thickness relative to the combined thickness of the protective film and insulating layer. This ensures that the connection pattern always penetrates through both layers to establish electrical connection, providing a margin of error that accommodates variations in layer thickness and positioning without compromising connection reliability.
Solution Approach 2:
The patent specifies that the thickness of the connection pattern should be substantially equal to or greater than the sum of the thicknesses of the protective film and insulating layer. This parameter relationship ensures reliable electrical connection while providing clear design guidelines for manufacturing, balancing connection reliability with manufacturability.
3Device complexity
If a direct ground connection is established without sufficient thickness, then the device complexity is reduced, but the harmful factors increase due to static electricity damage and electrical disconnection
Solution Approach 1:
The connection pattern with sufficient thickness acts as a cushioning measure against static electricity damage and electrical disconnection. By ensuring the connection pattern penetrates through both the protective film and insulating layer, the patent creates a robust electrical pathway that can withstand electrical surges and static discharge, protecting sensitive components before damage can occur.
Solution Approach 2:
The patent converts the potential harm of static electricity and electrical disconnection into a benefit by using the connection pattern as both a structural element and a protective pathway. The thick connection pattern not only establishes ground connection but also serves as a discharge path for static electricity, transforming a harmful factor into a protective mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable electrical connection between the ground pad and ground layer, preventing electrical disconnection and offering a discharge path for static electricity, thereby enhancing the reliability and performance of the display device.
Implementation Method 1
the connection pattern may electrically connect the ground pad portion and the ground layer
Data Source
AI summary
A drive portion for a display device may include: a flexible circuit film; a circuit board connected to the flexible circuit film; a protective film surrounding the flexible circuit film and the circuit board; and a connection pattern positioned between the circuit board and the protective film, wherein a first thickness of the connection pattern is substantially equal to or greater than a sum of a second thickness of a protection layer positioned on a surface of the circuit board and a third thickness of an insulating layer positioned on a surface of the protective film.