Display Device Driver Circuit Moisture Protection

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Solution Overview

Problem

Transistors with oxide semiconductor layers in display devices face reliability issues due to moisture and hydrogen ingress, leading to fluctuations in electrical characteristics, especially in driver circuit transistors under high-temperature and high-humidity conditions.

Innovation Solution

A display device structure is implemented with a pixel portion and a driver circuit portion, where the driver circuit portion includes an opening portion in an inorganic material layer to prevent moisture and hydrogen from entering the oxide semiconductor layer, using a layered insulating film structure with a silicon nitride film and an acrylic-based resin film to facilitate gas release and reduce unevenness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If oxide semiconductor layers are used in transistors for driver circuits, then field-effect mobility and operating speed are improved, but reliability deteriorates due to moisture and hydrogen ingress causing threshold voltage shifts

Engineering Contradiction:
Improveoperating speedVSAvoidreliability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent applies this principle by forming a protective inorganic film layer (such as aluminum oxide, titanium oxide, or silicon oxide) over the oxide semiconductor layer. This thin film acts as a barrier shell that prevents moisture and hydrogen from penetrating into the semiconductor layer, thereby maintaining reliability while allowing the high-speed operation enabled by the oxide semiconductor material to continue

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent implements this principle by creating an inert protective environment through the inorganic film that blocks external contaminants (moisture and hydrogen) from reaching the oxide semiconductor layer. The film establishes a protected zone around the semiconductor material, effectively isolating it from harmful atmospheric elements that would otherwise cause threshold voltage shifts and reliability degradation

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

2Ease of manufacture

If organic materials are used to reduce unevenness in transistors, then manufacturing ease is improved, but harmful factors increase due to moisture release from the organic material under high-temperature and high-humidity conditions

Engineering Contradiction:
Improvemanufacturing easeVSAvoidmoisture release
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent applies this principle by introducing an inorganic film as an intermediary layer between the organic material and the oxide semiconductor layer. This intermediate film serves as a barrier that prevents moisture released from the organic material under high-temperature and high-humidity conditions from reaching and contaminating the semiconductor layer, thus eliminating the harmful effect while preserving the manufacturing advantages of using organic materials for planarization

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If driver circuits are integrated with pixel transistors on the same substrate, then device complexity is reduced, but reliability deteriorates due to higher electric load on driver circuit transistors making them more susceptible to moisture damage

Engineering Contradiction:
Improvedevice complexityVSAvoidreliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent implements this principle by applying the protective inorganic film specifically to regions containing driver circuit transistors, which are more susceptible to moisture damage due to higher electric loads. This localized protection strategy allows the integration benefits to be maintained while providing enhanced reliability protection where it is most needed, rather than uniformly protecting all transistor regions

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This structure effectively inhibits the ingress of moisture and hydrogen into the oxide semiconductor layer, stabilizing the electrical characteristics and enhancing the reliability of the transistors, particularly in the driver circuit portion, thereby improving the overall performance and longevity of the display device.

Implementation Method 1

an inorganic material layer which covers the driving transistor and includes a silicon nitride film

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

an opening portion which is formed in the inorganic material layer... impurities such as moisture contained in the organic material are diffused outside from the opening portion

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS9312278B2Display device and electronic device
Publication Date: 2016.04.12 SEMICON ENERGY LAB CO LTD
  • US9312278B2 patent drawing
  • US9312278B2 patent drawing
  • US9312278B2 patent drawing

AI summary

To improve the reliability of a transistor as well as to inhibit fluctuation in electric characteristics. A display device includes a pixel portion and a driver circuit portion outside the pixel portion; the pixel portion includes a pixel transistor, a first insulating film covering the pixel transistor and including an inorganic material, a second insulating film including an organic material over the first insulating film, and a third insulating film including an inorganic material over the second insulating film; and the driver circuit portion includes a driving transistor to supply a signal to the pixel transistor, the first insulating film covering the driving transistor, and the second insulating film over the first insulating film, and further includes a region in which the third insulating film is not formed over the second insulating film or a region in which the second insulating film is not covered with the third insulating film.