Display Electrode Connection Layout Without Extra Mask Steps

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Solution Overview

Problem

Existing display device fabrication methods are inefficient due to the need for additional mask processes to connect conductive layers, which increases processing complexity and time.

Innovation Solution

A display device structure and fabrication method that eliminates the need for a separate mask process by using a connection pattern in the third conductive layer to electrically connect the first and second conductive layers through a contact hole that penetrates the via layer and passivation layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a separate mask process is used to connect conductive layers, then the connection between first and second conductive layers is achieved, but the fabrication process complexity and processing time increase

Engineering Contradiction:
Improveconnection reliabilityVSAvoidfabrication process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the connection pattern formation with the third conductive layer deposition process. The connection pattern is formed simultaneously with the third conductive layer in a single deposition and patterning step, eliminating the need for a separate mask process that would otherwise be required to create connection structures between the first and second conductive layers.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The third conductive layer serves multiple functions: it provides the main conductive path for the display device, forms the connection pattern to electrically connect the first and second conductive layers, and eliminates the need for separate connection structures. This multi-functional design reduces overall fabrication process complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If a separate mask process is used to connect conductive layers, then the connection between first and second conductive layers is achieved, but the production time increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidfabrication efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent combines the connection pattern formation with the third conductive layer deposition into a single manufacturing step. This merging of operations reduces the total number of process steps and eliminates the time required for a separate mask process, thereby improving fabrication efficiency and productivity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The connection pattern is formed preliminarily during the third conductive layer deposition process rather than as a subsequent separate step. This preliminary action ensures that the connection structures are already in place before final device assembly, reducing overall production time without compromising connection reliability.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If additional mask processes are used, then conductive layers can be connected, but the fabrication process is prolonged

Engineering Contradiction:
Improveelectrical connectionVSAvoidprocessing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent merges the electrical connection function into the third conductive layer formation process. The connection pattern is created simultaneously with the main conductive layer, eliminating the need for additional mask processes and reducing processing time while maintaining reliable electrical connections between conductive layers.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP3993033B1Display device and method of fabricating the same
Publication Date: 2025.05.14 SAMSUNG DISPLAY CO LTD
  • EP3993033B1 patent drawingFigure 1
  • EP3993033B1 patent drawingFigure 2
  • EP3993033B1 patent drawingFigure 3

AI summary

A display device includes a first conductive layer disposed on a substrate, a passivation layer disposed on the first conductive layer, a second conductive layer disposed on the passivation layer, a via layer disposed on the second conductive layer, a third conductive layer disposed on the via layer, the third conductive layer including a first electrode, a second electrode, a connection pattern, the first electrode, the second electrode, and the connection pattern being spaced apart from each other, and a light emitting element, a first end and a second end of the light emitting element being disposed on the first electrode and the second electrode, respectively, wherein the connection pattern electrically connects the first conductive layer and the second conductive layer through a first contact hole penetrating the via layer and the passivation layer.