Display Electrodes With Laser-Cuttable Segments For Short Circuit Repair
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Solution Overview
Problem
Display devices face short circuit defects due to conductive foreign objects between stacked wires with different potentials, leading to increased wiring resistance and deterioration of display quality, which existing methods struggle to resolve without exacerbating resistance issues.
Innovation Solution
A display device design featuring electrodes with cuttable portions and openings that allow for laser-induced cuts to isolate foreign objects, maintaining overlapping structures to prevent unwanted connections and minimize resistance increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If openings are provided in electrodes to resolve short circuits via laser cutting, then short circuit defects can be resolved, but wiring resistance increases
Solution Approach 1:
The electrode is divided into multiple segments: conductive portions for current flow, cuttable portions for laser access, and openings for foreign object removal. This segmentation allows the electrode to maintain conductivity while enabling short circuit repair functionality.
Solution Approach 2:
Different portions of the electrode have different properties: conductive portions maintain low resistance, while cuttable portions and openings are specifically designed to be accessible to laser beams for cutting operations. This local differentiation resolves short circuits without compromising overall wiring resistance.
2Area of stationary object
If wires are stacked in overlapping positions to save space, then device compactness improves, but interwire short circuit risk increases
Solution Approach 1:
The patent utilizes the vertical stacking dimension to arrange electrodes in overlapping positions, achieving compact device area. The interlayer insulating layer provides electrical isolation in the vertical dimension, preventing short circuits while maintaining compact footprint.
Solution Approach 2:
An interlayer insulating layer is introduced between stacked electrodes to prevent electrical contact. This intermediary layer allows overlapping wire布局 for compactness while maintaining electrical isolation to prevent short circuits.
3Ease of repair
If laser beams are used to cut wires for resolving short circuits, then short circuit repair is enabled, but wiring resistance increases due to cut portions
Solution Approach 1:
The electrode is segmented into conductive portions that maintain current flow and cuttable portions that can be removed via laser. This segmentation enables repair of short circuits by cutting only the affected cuttable portions while preserving the conductive portions for low-resistance current flow.
Solution Approach 2:
The cuttable portions are designed to be extractable via laser cutting. When a short circuit occurs, the laser beam removes the cuttable portions through the openings, isolating the foreign object while minimizing impact on the remaining conductive portions and their resistance characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively resolves short circuit defects while suppressing wiring resistance, ensuring stable voltage supply to all areas and preventing display quality deterioration.
Implementation Method 1
a plurality of first cuttable portions that are cuttable by irradiation with a laser beam; a plurality of second cuttable portions that are cuttable by irradiation with the laser beam
Data Source
AI summary
A display device includes a lower wiring layer, an interlayer insulating layer, and an upper wiring layer. The lower wiring layer includes first partial electrode portions, first cuttable portions, and first openings; the upper wiring layer includes second partial electrode portions, second cuttable portions, and second openings. The first partial electrode portions and the second partial electrode portions are disposed in overlapping positions in the stacking direction; all the first cuttable portions and the second openings are disposed in overlapping positions in the stacking direction; all the second cuttable portions and the first openings are disposed in overlapping positions in the stacking direction.