Display Emission Layer Patterning With Vacuum UV Dry Etching
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Solution Overview
Problem
The manufacturing process of display devices often causes damage to emission layers, particularly during the formation of organic layers in pixel areas, which hinders the production of wide and high-resolution display devices.
Innovation Solution
A deposition device and method that includes a vacuum environment with specific chambers for forming light emitting material layers, using vacuum ultraviolet rays to pattern photosensitive resin compositions, and performing dry etching processes with different gases to minimize damage to emission layers, allowing for the creation of high-resolution display devices with reduced emission layer damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing processes are used to form organic layers in pixel areas, then the manufacturing process can be completed, but damage occurs to the emission layer
Solution Approach 1:
The patent employs a vacuum environment throughout the manufacturing process, creating an inert atmosphere that prevents contamination and damage to the emission layer. The substrate is transferred through multiple chambers (organic layer formation chamber, photosensitive resin coating chamber, patterning chamber, etching chamber) all maintained at vacuum or low-pressure conditions, eliminating exposure to atmospheric contaminants that would otherwise damage the sensitive emission layer.
Solution Approach 2:
The manufacturing process is divided into distinct functional chambers: organic layer formation chamber for depositing light-emitting materials, photosensitive resin coating chamber for applying resist material, patterning chamber for vacuum UV exposure, and etching chamber for selective removal of organic layers. This segmentation allows each process step to be optimized independently while maintaining vacuum conditions throughout, preventing emission layer damage.
2Manufacturing precision
If vacuum ultraviolet rays are used for patterning photosensitive resin, then patterning precision is improved, but additional equipment and process complexity are required
Solution Approach 1:
The patent combines multiple functions into integrated chamber systems. The patterning chamber integrates vacuum UV light sources for photoexposure with the vacuum environment, eliminating the need for separate atmospheric exposure and vacuum transfer steps. The etching chamber combines plasma generation, gas delivery, and substrate processing in a single vacuum environment, achieving precise patterning without additional equipment.
3Reliability
If dry etching processes are performed in vacuum environment, then emission layer damage is minimized, but process time and energy consumption increase
Solution Approach 1:
The substrate remains in the vacuum environment throughout the entire manufacturing sequence without breaking vacuum or transferring to atmospheric conditions. The organic layer formation, photosensitive resin coating, patterning, and etching processes occur in continuous succession within vacuum or low-pressure chambers, eliminating idle time and repeated vacuum cycling that would increase total process time.
Solution Approach 2:
The patent employs controlled changes in pressure parameters across different chambers to optimize each process step. The organic layer formation uses high vacuum for precise deposition, the photosensitive resin coating operates at reduced pressure to prevent contamination, and the etching chamber maintains controlled vacuum conditions for selective removal. These parameter optimizations reduce process time while maintaining emission layer protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively minimizes damage to emission layers during the manufacturing process, enabling the production of high-resolution and wide display devices by using vacuum ultraviolet rays for patterning and dry etching without additional developing processes, resulting in simpler and more efficient manufacturing.
Implementation Method 1
irradiating vacuum ultraviolet rays to a photosensitive material layer
Implementation Method 2
forming a first light emitting material layer on a substrate
Implementation Method 3
forming a first emission layer according to a first dry etching process
Data Source
AI summary
A method for manufacturing a display device according to an embodiment includes forming a first light emitting material layer on a substrate; forming a first photosensitive pattern on the first light emitting material layer; and forming a first emission layer according to a first dry etching process with the first photosensitive pattern as a mask, wherein the forming of a first photosensitive pattern includes irradiating vacuum ultraviolet rays to a photosensitive material layer.