Electroluminescent Light Sources TRIZ Cases

A low-index layer between the emissive layer and electrode boosts light extraction while preserving carrier transport and simpler fabrication.

A spiro-linked 3D platinum(II) emitter suppresses stacking-driven self-quenching while enabling stable, tunable OLED emission across the visible spectrum.

An inverted OLED stack with thin-film encapsulation and a metal oxide barrier keeps sub-10 μm thickness, flexibility, and device lifetime.

An island oxide semiconductor enables laser removal of a common functional layer in non-display regions while preserving OLED sealing performance.

Cup-shaped receiving holes and a height adjustment layer improve LED alignment, electrode connection, luminance, contrast, and panel yield.

A three-layer lead wiring structure shields exposed sidewalls from etching damage, preserving OLED sealing performance and blocking moisture ingress.

An overlapping visible-light-transmitting region hides panel seams while balancing light transmission, electrode resistance, and luminance uniformity.

Transfer, setting, and driving elements enable parallel 2D light emission with higher uniformity and intensity for optical measurement and imaging.

A tuned hole-injection layer and current-responsive electron-transport layer cut driving voltage while improving organic EL efficiency and lifetime.

Near-infrared microcavity electrodes use thin Au, Ag, or Cu layers to raise reflectance, cut absorption, and improve emission efficiency.

A double passivation layer improves current uniformity, luminous efficiency, and impact durability in thin flexible display emitters.

A layered phosphor coating with poly(meth)acrylate binders protects Mn4+ red phosphors from degradation while preserving LED efficacy and CRI.

Signal paths embedded within the pixel region cut capture-to-display delay, improving moving-object tracking in wearable image displays.

A thinned inorganic film step and resin cover limit crack growth and moisture ingress in bendable display panels, reducing dark-spot failures.

Convex portions on the OLED bank improve RGB vapor deposition alignment while shielding deposited layers from mask-borne foreign matter.

A rigid repeating-unit polymer improves hole transport, film lamination, and working life in wet-formed organic EL layers.

A metal nitride barrier and island-shaped oxide layer suppress hydrogen diffusion and oxygen vacancies to stabilize metal oxide semiconductor characteristics.

A staggered emitter-receiver layout places sensors between LED gaps to enable external light capture without blocking display output.

Fibrous resin layers and impact relief structures protect thin electroluminescent emitters from local pressure and manufacturing stress.

A cluster-based inert gas process links pixel-circuit and OLED formation to avoid air exposure, improve alignment, and raise aperture ratio.

An inclined bank-side electrode reflects trapped EL light outward, expanding emission area while limiting drive voltage increase.

Vacuum UV patterning and dry etching form display emission layers with less damage, supporting wider and higher-resolution panels.

A single resist mask forms the pixel electrode and metal film together, cutting mask steps while preventing disconnection at level differences.

A TEG placed beside dummy pixel circuits can mirror the display-region TFT environment and improve characteristic measurement accuracy.

Alternating LED sections, transparent blocks, and cooling improve UV curing irradiance uniformity while limiting temperature-driven degradation.

A first electric field holds light emitting elements during gas-spray cleaning, removing foreign substances without misalignment or damage.

Matched openings in display and peripheral reflective layers keep mirror OLED reflectivity uniform while enabling bezel-less touch integration.

High-conductivity lamp supports with internal coolant channels improve LED heat dissipation, efficiency, and service life in photochemical reactors.

A resin-based thermal insulation layer blocks external heat around the heat dissipating layer, slowing OLED luminance degradation at high temperature.

Thin liquid crystal polarizers with dichroic material shrink visible seams between adjacent display units while resisting humidity damage.

Metal-mask deposition and resist-mask trimming create uniform EL layers while electrically isolating adjacent OLED pixels at lower cost.

A multi-surface bonding layout joins the photodetector and optical member while containing adhesive overflow to stabilize light-emitting device quality.

UV ozone or heat treatment removes channel-surface carbon in oxide TFTs, reducing NBTS threshold shift and easing process control.

Spectral overlap between host emission and guest absorption improves OLED energy transfer, raising external quantum efficiency and lifetime.

Partially overlapping panels and a visible-light-transmitting region reduce seam visibility while maintaining conductivity, display uniformity, and reliability.

A low-index electron-transport layer and quantum-dot color conversion improve OLED light outcoupling and efficiency without sacrificing reliability.

A nitride gas-block and separation layer prevents polyimide soot during laser lift-off, preserving transmittance and display uniformity.

Specific heterocyclic blue-emitting compounds raise OLED emission efficiency while lowering power use and supporting longer element lifetime.

Liquid conductive adhesive enables selective RGB LED transfer onto wiring boards, cutting lithography steps, cost, and transfer constraints.

An InP core with a ZnSeS shell improves blue-light absorption, stability, and green emission for brighter, more accurate displays.

Total internal reflection from a low refractive index layer limits high-angle light leakage in quantum dot sub-pixels, boosting luminance and color purity.

A self-quenching organometallic OLED dopant separates HOMO and LUMO to lower driving voltage, reduce roll-off, and preserve color purity.