Semiconductor LED Display Structure With Receiving Holes and Height Alignment
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Solution Overview
Problem
Current display devices using liquid crystal displays (LCDs) and active matrix organic light emitting diodes (AMOLEDs) face issues such as slow response time, limited flexibility, short lifespan, and high manufacturing costs, while semiconductor light-emitting elements struggle with reduced luminous efficiency and contrast due to exposure of phosphors and wirings.
Innovation Solution
A display device structure is proposed where semiconductor light-emitting elements are accommodated in cup-shaped receiving holes on a planarization layer, allowing for precise alignment and simplified wiring, and a height adjustment layer is used to facilitate electrode connection, improving manufacturing reliability and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If semiconductor light-emitting elements are used in display devices, then response time and lifespan are improved, but luminous efficiency and contrast are deteriorated due to exposure of phosphors and wirings
Solution Approach 1:
The patent extracts and removes the problematic elements (phosphors and wirings) from the light-emitting structure. By using semiconductor light-emitting elements that do not require phosphors for light generation and designing a structure where wirings are not exposed, the patent eliminates the source of luminous efficiency degradation while maintaining the lifespan advantages of semiconductor LEDs.
Solution Approach 2:
The patent applies different structural configurations to different regions: the light-emitting region uses semiconductor elements without phosphors, while the wiring region is designed with embedded or hidden conductors. This localized quality differentiation ensures that the areas critical for light emission maintain high luminous efficiency while other areas handle electrical functions.
2Manufacturing precision
If micro semiconductor light-emitting elements are used, then image quality and reliability are improved, but manufacturing precision is deteriorated due to alignment difficulties
Solution Approach 1:
The patent implements preliminary alignment actions during the manufacturing process by establishing precise positioning structures and alignment marks before the final assembly. This preliminary positioning ensures that micro semiconductor elements are correctly aligned with wirings and substrates, reducing rework and improving overall manufacturing precision.
3Reliability
If complex wiring structures are used to connect light-emitting elements, then electrical connection reliability is improved, but manufacturing time and cost are increased
Solution Approach 1:
The patent merges multiple functions into integrated structures where wirings serve both electrical connection and structural support roles. By combining the wiring layer with the substrate or encapsulation layer, the patent reduces the number of separate components and assembly steps, thereby maintaining electrical reliability while reducing manufacturing time and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances optical performance, reduces manufacturing time, and improves panel yield by enabling high-precision manufacturing and flexible display capabilities with enhanced luminance and contrast.
Implementation Method 1
light emitting diodes (LEDs) are well known light-emitting elements for converting an electrical current to light
Data Source
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Figure 3A~3B
AI summary
The present invention relates to a display device using a semiconductor light-emitting element and, particularly, to a display device using a semiconductor light-emitting element. A display device according to the present invention comprises: a substrate including a driving thin-film transistor; a semiconductor light-emitting element including a first conductive electrode and a second conductive electrode; and a planarization layer formed to cover the driving thin-film transistor and including a reception hole in which the semiconductor light-emitting element is received, wherein a height adjustment layer is formed between the substrate and the planarization layer so as to make one of the first and the second conductive electrode and one surface of the planarization layer coincide with each other in height.