LED Display Bonding With Conductive Adhesive for Flexible Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current display technologies, such as LCDs and AMOLEDs, face challenges including slow response time, limited flexibility, and high manufacturing costs due to the use of anisotropic conductive films for coupling semiconductor light emitting devices with wiring boards.
Innovation Solution
A manufacturing method using a liquid-phase conductive adhesive layer coated in a pattern on a wafer to facilitate the transfer of red, green, and blue semiconductor light emitting devices onto a single wiring board, eliminating the need for photo-lithographic processes and reducing manufacturing costs by allowing multiple transfers on a large area wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic conductive film is used to couple semiconductor light emitting devices with wiring board, then electrical and physical coupling is achieved, but manufacturing cost increases and transfer flexibility is restricted
Solution Approach 1:
The patent replaces expensive anisotropic conductive films with inexpensive conductive adhesives that can be applied in liquid form and cured. The conductive adhesive serves as a disposable, low-cost alternative that achieves the same electrical and mechanical coupling function without the high material costs associated with ACF
Solution Approach 2:
The patent changes the physical state of the conductive material from solid film form (ACF) to liquid adhesive form, enabling different application methods such as dispensing, printing, or dip-coating. This parameter change allows for more flexible and cost-effective manufacturing processes
2Reliability
If anisotropic conductive film is used for transfer, then coupling is achieved, but transfer flexibility is restricted and all devices in region must be transferred
Solution Approach 1:
The patent applies conductive adhesive only to specific local areas where semiconductor devices need to be transferred, rather than coating the entire substrate. This localized application enables selective transfer of individual devices or specific regions, providing flexibility in device placement and allowing partial transfers without requiring all devices in a region to be transferred
Solution Approach 2:
The conductive adhesive is applied in discrete patterns or segments corresponding to individual device locations, enabling independent transfer and placement of each device. This segmentation approach allows flexible assembly where devices can be transferred separately rather than as a complete array
3Manufacturing precision
If photo-lithographic process is used for pattern coating, then precise patterning is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces complex photo-lithographic mechanical systems with simpler direct application methods for conductive adhesive. Techniques such as dispensing, printing, or dip-coating eliminate the need for photoresist coating, patterning, development, and etching steps, significantly reducing process complexity while maintaining adequate patterning precision for device attachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables flexible and cost-effective manufacturing of display apparatuses with improved response time and flexibility, reducing the complexity and expense associated with traditional transfer methods.
Implementation Method 1
a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer and electrically connected to the wiring electrodes
Implementation Method 2
a conductive adhesive layer covering the wiring electrodes
Data Source
AI summary
Discussed is a display apparatus including a wiring board having wiring electrodes; a conductive adhesive layer covering the wiring electrodes; a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer and electrically connected to the wiring electrodes; and an insulating material disposed between the plurality of adhesive regions to fill between the plurality of semiconductor light emitting devices, wherein each electrode of the plurality of semiconductor light emitting devices includes a first conductive electrode, a first conductive semiconductor layer on the first conductive electrode, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, and a second conductive electrode on the second conductive semiconductor layer, and wherein the second conductive electrode is disposed on one surface of the second conductive semiconductor layer.