Light-Emitting Assembly Bonding Structure to Contain Adhesive Overflow
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Solution Overview
Problem
The manufacturing process of light-emitting devices often encounters issues with poor bonding, leading to instability in the quality of the final product, which existing technologies have not adequately addressed.
Innovation Solution
A light-emitting device design that includes a plurality of light-emitting elements, a photodetector, and an optical member, where the photodetector and optical member are bonded using a bonding portion that contacts their respective surfaces and at least a part of the optical member's inner side surface, with the bonding portion strategically positioned to minimize adhesive overflow and enhance adhesion, thereby stabilizing the device's quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding portion is used to bond the photodetector and optical member, then adhesion is enhanced, but adhesive overflow occurs leading to poor bonding
Solution Approach 1:
The patent applies local quality by creating a recessed portion only in the specific area where adhesive overflow might occur, while leaving other bonding areas flat. This localized modification allows the bonding portion to contact the first bonding surface, second bonding surface, and first inner side surface, enhancing adhesion in critical areas without causing overflow in other areas.
2Strength
If the bonding area is increased to improve adhesion, then bonding strength is enhanced, but adhesive overflow increases causing poor bonding
Solution Approach 1:
The patent converts the potential harm of adhesive overflow into a benefit by designing the recessed portion to specifically contain and direct the adhesive. The adhesive that would otherwise overflow harmfully is now channeled into the recessed portion, where it contacts the first inner side surface and enhances bonding strength without causing poor bonding quality.
3Strength
If the bonding portion contacts multiple surfaces including the first inner side surface, then adhesion area is increased, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the bonding interface into distinct surfaces: the first bonding surface, the second bonding surface, and the first inner side surface of the recessed portion. This segmentation allows each surface to serve a specific bonding function, increasing the total adhesion area while maintaining a relatively simple overall structure that is easy to manufacture.
Data Source
AI summary
A light-emitting device includes a plurality of light-emitting elements, a photodetector, an optical member and a bonding portion. The light-emitting elements include a first light-emitting element configured to emit first light and a second light-emitting element configured to emit second light. The photodetector is configured to receive a part of light emitted from each of the light-emitting elements. The photodetector has a first bonding surface. The optical member has a second bonding surface and a first inner side surface. The first inner side surface is continuous from the second bonding surface. The light emitted from each of the plurality of light-emitting elements is configured to pass through the optical member. The bonding portion bonds the photodetector and the optical member with the bonding portion being in contact with the first bonding surface, the second bonding surface, and at least a part of the first inner side surface.