OLED Lead Wiring Structure for Etch-Resistant Sealing
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Solution Overview
Problem
In organic EL display devices, the lead wiring lines are prone to damage during the manufacturing process due to exposure to developing and etching solutions, leading to degraded sealing performance and potential deterioration of the organic EL element.
Innovation Solution
The display device incorporates lead wiring lines formed of a sequence of first, second, and third metal layers, where the third metal layer covers the side surfaces and upper faces of the first and second metal layers, and these wiring lines are electrically connected to display wiring lines and terminals, ensuring protection and maintaining the integrity of the sealing film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lead wiring lines are formed with simple structure, then manufacturing process is simple, but the lead wiring lines are damaged by developing and etching solutions
Solution Approach 1:
The lead wiring line is constructed as a composite structure with three metal layers: a first metal layer (Aluminum or铝合金), a second metal layer (Titanium), and a third metal layer (Platinum or Iridium). The third metal layer with high chemical stability covers the side surfaces and upper face of the second metal layer, providing resistance against developing and etching solutions while maintaining electrical conductivity and structural integrity throughout the manufacturing process.
2Ease of manufacture
If the third metal layer covers only the upper face of the second metal layer, then manufacturing is easier, but side surfaces remain vulnerable to solution damage
Solution Approach 1:
The third metal layer extends from the upper face of the second metal layer down to cover the side surfaces, creating a three-dimensional protective configuration. This dimensional extension ensures that the chemically stable third metal layer completely encloses the second metal layer, preventing exposure to harmful solutions from all directions while maintaining a manufacturable structure.
3Reliability
If lead wiring lines are made more robust to prevent damage, then reliability improves, but sealing performance may be compromised
Solution Approach 1:
The protective third metal layer is selectively applied to specific regions of the lead wiring line structure where it is most needed - covering the side surfaces and upper face of the second metal layer that are exposed to developing and etching solutions. This localized protection approach enhances damage resistance precisely where required without unnecessarily complicating the overall structure or compromising sealing film formation capabilities.
Data Source
AI summary
A lead wiring line is provided in a frame region to extend therein while intersecting with a frame-shaped dam wall, is formed of a same material and in a same layer as each of a plurality of display wiring lines in which a first metal layer, a second metal layer, and a third metal layer are layered in sequence, is electrically connected to the plurality of display wiring lines on a display region side, and is electrically connected to a terminal on a terminal portion side. The third metal layer is provided to cover a side surface of the first metal layer, and a side surface and an upper face of the second metal layer.