Display Encapsulation Layer Removal Using Sacrificial Laser Cracking
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Solution Overview
Problem
The existing methods for manufacturing display apparatuses face challenges such as increased costs and precise alignment issues due to the repeated use and damage of masks during the formation of encapsulation layers, which complicates the manufacturing process and increases costs.
Innovation Solution
A method involving the formation of a sacrificial layer in the pad area, followed by the creation of cracks in the encapsulation layer using a laser beam, allowing for the removal of the encapsulation layer in the pad area without the need for additional masks, thereby simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mask is used repeatedly to form the encapsulation layer, then the encapsulation layer can be formed in the set area, but the mask gets damaged and needs periodic replacement, increasing manufacturing costs and alignment complexity
Solution Approach 1:
A mask pattern layer is formed preliminarily on the substrate before forming the encapsulation layer. This pre-formed mask pattern layer serves as a permanent alignment reference that eliminates the need for repeated mask replacements and realignments during encapsulation layer formation, thereby reducing manufacturing costs and process complexity while maintaining reliable encapsulation layer formation in the set area
Solution Approach 2:
The mask pattern layer acts as an intermediary element between the substrate and the encapsulation layer. It provides a stable reference structure that facilitates precise alignment without requiring direct mask-substrate alignment operations, thus eliminating the harmful effects of mask damage and realignment complexity
2Manufacturing precision
If a mask is used to form the encapsulation layer in a set area, then the encapsulation layer is formed only in the predetermined area, but the mask requires precise alignment with the substrate, increasing manufacturing complexity
Solution Approach 1:
The mask pattern layer is formed preliminarily on the substrate with precise positioning before the encapsulation layer formation process begins. This pre-established reference structure eliminates the need for complex real-time mask alignment operations, thereby achieving precise encapsulation layer area control while simplifying the manufacturing process
Solution Approach 2:
The mask pattern layer creates a permanent copy of the desired encapsulation area pattern directly on the substrate. This copied pattern serves as a stable template that guides encapsulation layer formation without requiring repeated mask alignment operations, thus achieving manufacturing precision while reducing process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient removal of the encapsulation layer in the pad area, reducing manufacturing costs and simplifying the alignment process, while maintaining the integrity of the encapsulation layer over the display area, thus enhancing the manufacturing efficiency.
Implementation Method 1
The forming of the cracks may include irradiating a laser beam to (e.g., into) the portion of the encapsulation layer which is disposed above the sacrificial layer
Implementation Method 2
The forming of the cracks may include using the laser beam having an absorbance in an organic compound greater than an inorganic compound
Implementation Method 3
forming cracks in at least a portion of the encapsulation layer by increasing a volume of the sacrificial layer or by gasifying or evaporating at least a portion of the sacrificial layer
Implementation Method 4
forming cracks in at least a portion of the encapsulation layer by increasing a volume of the sacrificial layer or by gasifying or evaporating at least a portion of the sacrificial layer
Implementation Method 5
forming cracks in at least a portion of the encapsulation layer by increasing a volume of the sacrificial layer or by gasifying or evaporating at least a portion of the sacrificial layer
Data Source
AI summary
A method of manufacturing a display apparatus includes preparing a substrate including a display area and a pad area outside of the display area, forming a sacrificial layer in the pad area, forming an encapsulation layer over the display area and the pad area, forming cracks in at least a portion of the encapsulation layer by increasing a volume of the sacrificial layer or by gasifying or evaporating at least a portion of the sacrificial layer, and removing at least a portion of the encapsulation layer in the pad area. A display apparatus is manufactured according to the manufacturing method.