Display Device ESD Countermeasure via Multi-Layer Wiring
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Solution Overview
Problem
The manufacturing process of active matrix substrates for display devices often results in static electricity, leading to electrostatic discharge (ESD) that can cause breakdown of insulating films and short circuits between wiring lines, rendering the devices non-functional.
Innovation Solution
A manufacturing method that electrically connects control lines and power source lines via a second or third metal layer, forming branch lines and intersecting portions to reduce the risk of insulating film breakdown by providing a path for static electricity to dissipate, while maintaining electrical independence of these lines until the third metal layer is patterned.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If control lines and power source lines are electrically insulated from each other, then electrical independence is maintained, but static electricity causes high voltage buildup leading to insulating film breakdown and short circuits
Solution Approach 1:
A third metal layer is introduced as an intermediary conductive path between control lines and power source lines. This intermediate layer allows controlled electrical connection to dissipate static electricity while maintaining insulation through the second insulating film, preventing direct short circuits between adjacent control lines.
Solution Approach 2:
The electrical connection path is segmented into multiple layers: control lines in the first metal layer, power source lines in the second metal layer, and interconnections through the third metal layer. This segmentation allows independent routing and controlled electrical interaction, enabling static electricity dissipation while maintaining overall electrical independence.
2Object-affected harmful factors
If control lines are electrically connected to dissipate static electricity, then insulating film breakdown is prevented, but short circuits may occur between adjacent control lines
Solution Approach 1:
The electrical connection is moved from a planar two-dimensional layout to a three-dimensional multi-layer structure. Control lines remain isolated in the first metal layer, while the third metal layer provides vertical interconnections through the second insulating film, enabling static electricity dissipation without creating horizontal short circuit paths between adjacent control lines.
Solution Approach 2:
The second insulating film serves as an intermediary barrier between the first metal layer (control lines) and third metal layer (connection paths). This intermediate insulating layer prevents direct contact between control lines while allowing controlled electrical connection through the third metal layer for static electricity dissipation.
3Reliability
If multiple metal layers and insulating films are added to manage static electricity, then ESD protection is improved, but manufacturing complexity increases
Solution Approach 1:
The third metal layer serves multiple functions: it provides electrical connection between control lines and power source lines for static electricity dissipation, maintains electrical independence through the insulating film structure, and enables controlled interaction between different signal lines. This multi-functionality reduces the need for additional dedicated ESD protection structures.
Solution Approach 2:
The ESD protection mechanism is merged with the existing multi-layer wiring structure. The third metal layer is integrated into the standard wiring architecture, combining signal transmission and static electricity dissipation functions in a unified structure, rather than adding separate ESD protection layers.
Data Source
AI summary
In a step of forming a plurality of control lines composed of a first metal layer a first metal layer branch line is formed. In a step of forming a plurality of power source lines composed of a second metal layer a second metal layer connecting portion is formed that connects each power source line with the first metal layer branch line via an opening of a first insulating film. In a step of forming a plurality of data signal lines composed of a third metal layer that is formed on a second insulating film the first metal layer branch line formed in the opening of the first insulating and the second metal layer connecting portion formed in an opening of the second insulating film are etched.