Display Device Groove Design for Tiled Substrate Mounting
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Solution Overview
Problem
Existing display device fabrication methods face challenges in reducing process defects and increasing yield, particularly due to difficulties in mounting large-sized light-emitting device array substrates and ensuring reliable thermal compression bonding without pressure increases.
Innovation Solution
A display device design featuring a circuit board with a groove that overlaps the boundary between light-emitting device array substrates, using non-conductive layers to fill the groove and prevent process failures, and employing a tiling scheme for mounting smaller substrates to avoid pressure issues during thermal compression bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single large-sized light-emitting device array substrate is mounted on the circuit board, then the display area is increased, but the mounting process becomes difficult and process defects increase
Solution Approach 1:
The invention divides the large display area into multiple smaller light-emitting device array substrates that can be independently mounted on the circuit board. This segmentation makes the mounting process easier and reduces process defects while achieving the desired large display area through the combined effect of multiple substrates arranged in a matrix pattern.
2Reliability
If thermal compression bonding is performed without pressure increase, then the reliability is improved, but the bonding strength may be insufficient
Solution Approach 1:
The invention changes the bonding parameters by performing thermal compression bonding at a constant pressure without further pressure increase after initial contact. This parameter change improves reliability by preventing defects caused by pressure variations while the initial compression provides sufficient bonding strength.
3Area of moving object
If the non-display region is reduced to display wider images, then the image width is increased, but the risk of process defects at boundaries increases
Solution Approach 1:
The invention uses multiple light-emitting device array substrates arranged in a matrix to achieve wide image display. The segmentation allows for proper spacing and boundary management between substrates, reducing the risk of process defects while maintaining the desired wide display area.
Solution Approach 2:
The invention performs preliminary mounting of multiple substrates with appropriate spacing before final assembly. This preliminary action allows for proper alignment and reduces boundary defects while achieving the wide display area needed for broader image coverage.
Data Source
AI summary
Display devices and methods of fabricating display devices are provided. The display device includes a circuit board; a first light-emitting device array substrate mounted on the circuit board; and a second light-emitting device array substrate mounted on the circuit board adjacent the first light-emitting device array substrate in a first direction. The circuit board defines a groove that overlaps a boundary between the first light-emitting device array substrate and the second light-emitting device array substrate.