Solid-State Devices TRIZ Cases

An organic light emitting display device combines display functions with multi-wavelength light therapy to eliminate the need for separate treatment units.

Phase changing monoclinic hafnium oxide to tetragonal reduces interfacial energy with niobium nitride electrodes.

A nonvolatile memory cell integrates a diffusion preventing film between metal electrodes and interlayer insulating films to maintain structural integrity.

A semiconductor stack uses specific electrode spacing to increase reflective area and reduce insulation coverage.

A perovskite layer replaces thin insulators to enhance adhesion between chalcogenide and substrate materials.

Thermoelectric structures transfer heat from image sensor detector arrays, reducing power consumption by isolating peripheral circuitry.

A protective coating on bonding metal prevents dissolution in aqueous solutions, maintaining high assembly yield for large displays.

A semiconductor light emitting device uses a recessed chip design paired with an oversized fluorescent material layer to redirect oblique excitation light.

Asymmetric transistor angles reduce SRAM cell area, resolving the trade-off between manufacturing simplicity and memory density.

Segmented n-type contact layers and a selectively doped superlattice reduce internal fields and current leakage to enhance electrostatic discharge resistance.

Elevated pass voltage during recovery reads corrects program disturb errors in 3D stacked non-volatile memory.

Discrete quantum dots between barrier layers eliminate polymeric matrices, reducing emission quenching and degradation in micro-LEDs.

A touch panel incorporates a light-shielding layer to block ambient light reflection from metal electrodes.

A light blocking member on the lower substrate surface reduces external reflection, improving visibility and transmissivity of transparent OLED panels.

Light-altering materials reduce crosstalk between adjacent LEDs by reflecting or absorbing stray photons, improving contrast without dark zones.

Segmented insulating layers minimize extreme height changes to prevent pixel-defining layer formation failures.

A pick-up device uses a destaticizing mechanism to neutralize electrostatic charges on semiconductor chips.

Embedding nanoparticles in tungsten diselenide layers mitigates efficiency droop while enabling precise wavelength control.

Laser ablation severs the electrical connection at the drain contact hole, eliminating brightening point defects without damaging surrounding components.

Segmented lower gate wiring lines reduce parasitic capacitance while preserving upper gate wiring line structural integrity.

A P+/N well junction diode serves as a program selector in standard CMOS processes to enable compact programmable resistive memory cells.

Higher doping in the Zener region reduces capacitance and improves response speed while maintaining precise clamp voltage control.

Oblique field lines expand the write temperature window and immunity to manufacturing variance.

A photoelectric conversion apparatus uses segmented semiconductor regions to maintain pixel sensitivity and prevent transistor performance reduction.

Segmented common electrode routings form drainage channels that prevent over-etching damage to gate lines during wet processing.

Segmented organic coating layers prevent moisture corrosion in display wire adhesion zones while maintaining flat surfaces for secure adhesive bonding.

Layered light filters direct infrared wavelengths to photodiodes via CDTI microstructures, reducing inter-channel crosstalk.

Portable electronic cassettes detach from bucky trays to resolve fixed detector immobility and reduce radiation exposure.

Integrates a photovoltaic cell and integrated circuitry on a common substrate to provide self-powering without obstructing the illuminated surface area.

A transmissive film between common electrodes suppresses external light reflection through destructive interference.

A touch sensor design positions transmitter and receiver electrode layers on opposite substrate surfaces to enhance noise robustness.

Segmented deep device isolation patterns with oxidized semiconductor layers improve integration density while reducing manufacturing complexity.

An optoelectronic device uses an uninterrupted first semiconductor layer to integrate a light-emitting component and a field-effect transistor.

Programmable bus with direct wire connection switches and input selectors configures logic block connections.

A hole blocking portion spaces the first common layer between adjacent sub-pixel areas.

A common anodic oxidation process forms magnetic material columns in both memory cell and peripheral regions using identical structural configurations.

Laser-ablated groove regions in the top and bottom members allow the display panel to bend along a neutral plane, reducing the visible peripheral region.

Arbitrary shape microcomponents direct incident radiation into photodetector mesas via waveguiding, resolving alignment defects in large-scale arrays.

Reflective ceramic substrate and vertical lens structure improve light extraction efficiency while maintaining miniaturized chip-scale packaging.

A light extraction substrate uses scattering particles and a buffer layer to form a random network structure within an organic light-emitting element.

Segmented charge-trapping material blocks charge migration between memory cells, resolving data retention issues in three-dimensional NAND arrays.

Nested insulating patterns and air gaps in variable resistance memory devices maintain consistent electrical characteristics during power interruptions.

Lattice emission spacing prevents crosstalk interference, improving fingerprint identification precision.

Grooves filled with non-conductive layers separate tiled substrates, preventing pixel loss and boosting yield during thermal compression bonding.

A TFT array substrate incorporates a backup common electrode line positioned between insulating layers to maintain electrical isolation.

Through-holes in plastic substrates allow direct metal connections, reducing defect ratios and equipment costs for large displays.

An ESD clamp uses a tuning circuit to adjust holding voltage for stable operation.

A display panel integrates a sensing region with a cathode metal gap to route visible light directly into an optical sensor.