Flexible Display Substrate Through-Hole Assembly
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Solution Overview
Problem
Existing flexible display manufacturing processes face challenges in connecting large-sized substrates efficiently, leading to increased defect ratios and higher production costs, particularly due to the difficulty in connecting driving lines and the need for additional equipment for larger sizes.
Innovation Solution
A method involving the formation of through-holes in plastic substrates by patterning a lower electrode before substrate preparation, allowing for easy connection of substrates via these holes, and using a metal layer to facilitate assembly, which reduces the need for additional equipment and allows for defect replacement without full substrate replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If large-sized substrates are used to manufacture display devices, then the display size is improved, but the defect ratio increases
Solution Approach 1:
The patent divides the large substrate into multiple smaller substrate units that can be manufactured separately with lower defect rates, then connects them together to form the desired large display device. This segmentation approach allows each small substrate to be produced with high reliability while achieving the overall large size requirement.
Solution Approach 2:
The patent employs a modular design where multiple small substrates are nested or assembled together to form a larger display structure. Each small substrate acts as an independent module that can be connected through edge regions, allowing the system to achieve large overall size while maintaining the manufacturing advantages of small individual units.
2Area of stationary object
If additional equipment is introduced to manufacture large-sized substrates, then the manufacturing capability is improved, but the device complexity and cost increase
Solution Approach 1:
By segmenting the manufacturing process into smaller substrate production units, the patent eliminates the need for specialized large-substrate manufacturing equipment. Existing standard equipment can be used to produce multiple small substrates that are then assembled, thereby avoiding the complexity and cost of new equipment investment.
Solution Approach 2:
The patent combines multiple small substrates manufactured by existing equipment into a large display device through a connection process. This merging approach allows the system to achieve large substrate functionality without requiring the acquisition of new large-substrate manufacturing equipment.
3Ease of operation
If through-holes are formed in substrates for connection, then the ease of assembly is improved, but the manufacturing precision requirement increases
Solution Approach 1:
The patent forms through-holes and lower electrodes in advance during the substrate manufacturing process, before the actual assembly takes place. This preliminary action ensures that the connection structures are already prepared with high precision, reducing the complexity and precision requirements of the subsequent assembly process.
Solution Approach 2:
The through-holes serve as intermediary connection structures that facilitate the assembly of multiple substrates. By preparing these intermediary connection elements in advance with precise positioning, the patent enables easy assembly while maintaining high manufacturing precision through controlled formation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient assembly of large-sized display devices with reduced defect rates and production costs, allowing for various substrate shapes and improved yield without requiring new equipment, and simplifies the assembly process.
Implementation Method 1
forming a plurality of photoresist columns at an upper edge region of a glass substrate by a photo patterning process
Implementation Method 2
evaporating a solvent of the plastic chemical liquid to semi-harden a plastic substrate and to expose an upper portion of the photoresist columns
Implementation Method 3
firing and curing the plastic chemical liquid to form the plastic substrate
Data Source
AI summary
A method of manufacturing a display device includes: forming a plurality of photoresist columns at an upper edge region of a glass substrate by a photo patterning process; coating a plastic chemical liquid on an entire upper surface of the glass substrate to cover the photoresist columns; evaporating a solvent of the plastic chemical liquid to semi-harden a plastic substrate and to expose an upper portion of the photoresist columns; forming a plurality of through-holes at an edge region of the surface of the semi-hardened plastic substrate by removing the photoresist columns; firing and curing the plastic chemical liquid to form the plastic substrate; and coating a metal layer on an edge region of the surface of the plastic substrate with the through-holes.