3D Memory Program Disturb Countermeasure
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Solution Overview
Problem
In 3D stacked non-volatile memory devices, the reduced spacing between memory cells leads to program disturb issues, where adjacent cells' programming causes electron injection into charge trapping layers, resulting in impaired read operations due to parasitic cells formed between memory cells.
Innovation Solution
Implementing an error correction code (ECC) to detect uncorrectable errors and using an elevated pass voltage during data recovery read operations to narrow and lower the threshold voltage distribution, compensating with adjusted control gate, source voltage, or sensing circuit parameters to facilitate accurate data retrieval.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory cells are placed closer together to increase storage density, then storage capacity is improved, but program disturb errors increase due to charge trapping between adjacent cells
Solution Approach 1:
The patent applies preliminary action by performing a data recovery read operation before the normal read operation. This recovery read uses an elevated pass voltage to compensate for program disturb effects on neighboring word lines, thereby preemptively correcting threshold voltage shifts and enabling accurate data retrieval despite high-density cell placement
Solution Approach 2:
The patent changes the pass voltage parameter from a nominal level to an elevated level during the data recovery read operation. This parameter change compensates for the program disturb effects caused by adjacent cell programming, allowing the system to maintain data read accuracy even when cells are densely packed
2Ease of operation
If programming voltage is applied to adjacent word line to program memory cells, then programming function is achieved, but threshold voltage distribution of neighboring cells becomes disturbed
Solution Approach 1:
The patent applies preliminary anti-action by using an elevated pass voltage on the adjacent word line during a data recovery read operation. This counteracts the program disturb effects that occur when programming voltage is applied to neighboring cells, thereby preserving the threshold voltage distribution and enabling accurate data reading
3Duration of action of stationary object
If charge trapping layer is used to store data in 3D stacked memory, then non-volatile storage is achieved, but program disturb occurs due to charge injection between adjacent cells
Solution Approach 1:
The patent converts the harmful program disturb effect into a beneficial outcome by using an elevated pass voltage during a data recovery read operation. This recovery read detects and compensates for charge injection effects between adjacent cells, thereby transforming the potential data corruption into an opportunity for error correction and ensuring accurate data retrieval
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable reading of data affected by program disturb by correcting errors and improving read accuracy through ECC and elevated pass voltage techniques, ensuring data integrity in highly scaled 3D memory devices.
Implementation Method 1
program disturb issues due to charge trapping between adjacent cells
Data Source
AI summary
Techniques for reading data from memory cells arranged along a common charge trapping layer. One example is in a 3D stacked non-volatile memory device. Memory cells on a word line layer WLLn can be disturbed by programming of memory cells on an adjacent word line layer WLLn+1, resulting in uncorrectable errors. The memory cells on WLLn are read in a data recovery read operation which applies an elevated pass voltage to WLLn+1. The elevated pass voltage decreases and narrows the threshold voltages on WLLn, which facilitates reading. The data recovery read operation compensates for the lower threshold voltages of the cells by lowering the control gate voltage, raising the source voltage or adjusting a sensing period, demarcation level or pre-charge level in sensing circuitry. The elevated pass voltage can be stepped up in repeated read attempts until there are no uncorrectable errors or a limit is reached.


