Display Insulating Layer Structure for Short-Circuit Reliability
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Solution Overview
Problem
Defects in insulating layers of display devices can lead to reliability issues, including damage to circuit elements and short circuits, which existing technologies have not adequately addressed.
Innovation Solution
A display device structure featuring a base layer, a first pattern, and an insulating layer with multiple layers, where at least two layers of the insulating layer have the same material, and the lower and upper layers are formed through separate deposition processes to prevent defects and maintain interface characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single insulating layer is used, then the manufacturing process is simple, but defects can occur leading to short circuits and reliability issues
Solution Approach 1:
The insulating layer is divided into multiple sub-layers (first insulating layer, second insulating layer, third insulating layer) with different materials and functions. Each layer serves specific purposes: the first layer provides base insulation, the second layer prevents hydrogen diffusion, and the third layer provides additional protection. This segmentation eliminates defects that would occur in a single-layer structure while maintaining overall reliability.
Solution Approach 2:
The insulating layer uses composite material structure combining different materials (silicon nitride, silicon oxide, silicon oxynitride) in specific sequences. Each material contributes unique properties: silicon nitride for high insulation and hydrogen barrier, silicon oxide for stress control and interface quality, and silicon oxynitride for combined benefits. This composite approach prevents defects while managing mechanical and electrical properties.
2Reliability
If multiple insulating layers with different materials are used, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into separate deposition steps for each insulating layer, allowing independent optimization of each layer's deposition parameters. The first insulating layer (silicon nitride) is deposited with parameters optimized for hydrogen barrier properties, the second layer (silicon oxide) with parameters for stress control, and the third layer (silicon oxynitride) for final protection. This segmentation simplifies process control compared to attempting to deposit a complex multi-material layer in a single step.
Solution Approach 2:
Different deposition parameters are applied for each insulating layer to optimize specific properties. The deposition temperature, pressure, and gas flow ratios are adjusted for each layer material to achieve desired film qualities such as stress control, density, and interface characteristics. This parameter optimization for each layer ensures high reliability while maintaining manufacturability through systematic process control.
3Reliability
If the insulating layer is made thicker to prevent defects, then reliability improves, but the device area increases
Solution Approach 1:
Instead of using a single thick insulating layer, the patent employs a composite structure of three thinner layers with different materials. Each layer contributes to defect prevention through its specific material properties: silicon nitride for hydrogen barrier, silicon oxide for interface quality, and silicon oxynitride for additional protection. This composite approach achieves equivalent or superior reliability to a single thick layer while maintaining a compact overall thickness and device area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents reliability decreases due to insulating layer defects, ensuring consistent interface characteristics and reducing the risk of short circuits by using separate deposition processes for the lower and upper layers of the insulating layer.
Implementation Method 1
the lower and upper layers are formed through separate deposition processes to prevent defects and maintain interface characteristics
Data Source
AI summary
A display device includes a base layer; a first pattern disposed on the base layer; an insulating layer disposed on the first pattern and including layers; and a second pattern disposed on the insulating layer. At least two of the layers of the insulating layer include a same material.