Display Layer Openings to Cut Photomasks and Pixel Area
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Solution Overview
Problem
The increasing number of photomasks in the manufacturing process of display devices leads to higher manufacturing time and cost, as well as potential damage to the semiconductor layer.
Innovation Solution
The proposed solution involves reducing the number of photomasks by optimizing the manufacturing process, specifically by using a method that forms a display device with a substrate, conductive layers, insulating layers, and active patterns, where the insulating layers have openings that expose the conductive layers, and the openings are designed to minimize the area and maximize the resolution of each pixel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the number of photomasks is increased to achieve precise patterning of multiple layers, then the manufacturing precision is improved, but the manufacturing time and cost increase
Solution Approach 1:
The patent combines multiple photomask processes into a single photomask process by forming first and second openings in the same photomask. This merging of processes reduces the total number of photomasks needed while maintaining the precision of patterning multiple conductive layers and insulating layers, thereby reducing manufacturing time without sacrificing patterning accuracy.
Solution Approach 2:
The patent segments the opening formation process by creating openings with different breadths (first opening and second opening) in a single photomask. This segmentation allows different regions of the photomask to have different opening sizes, enabling precise control over the dimensions of different conductive layers and insulating layers simultaneously, thus achieving high manufacturing precision with reduced process steps.
2Manufacturing precision
If the number of photomasks is increased to achieve precise patterning of multiple layers, then the manufacturing precision is improved, but the manufacturing cost increases
Solution Approach 1:
The patent merges multiple photomask fabrication steps into one, reducing the total number of photomasks required. This consolidation directly lowers manufacturing costs associated with photomask production, storage, and handling, while the segmented opening design ensures that patterning precision is maintained across all layers.
Solution Approach 2:
The single photomask serves multiple functions by containing both first openings for exposing the first conductive layer and second openings for exposing the second conductive layer. This multi-functionality eliminates the need for separate photomasks for each layer, reducing overall manufacturing cost while maintaining the precision required for complex multi-layer structures.
3Manufacturing precision
If more photomasks are used in the manufacturing process, then the manufacturing precision is improved, but the semiconductor layer damage increases
Solution Approach 1:
The patent combines multiple photomask exposure steps into a single exposure process, reducing the number of times the semiconductor layer is subjected to photomask handling and alignment procedures. This merging minimizes cumulative damage to the semiconductor layer while maintaining the precision of patterning through the segmented opening design.
4Area of moving object
If the number of openings for contact between different layers is reduced, then the pixel area is reduced, but the electrical connection between layers may be compromised
Solution Approach 1:
The patent applies local quality by creating openings with different breadths at different locations in the photomask. The first openings have a first breadth optimized for exposing the first conductive layer, while the second openings have a second breadth optimized for exposing the second conductive layer. This localized optimization ensures reliable electrical connections are maintained in each region while minimizing the overall pixel area.
Data Source
AI summary
A display device according to an embodiment of the present disclosure includes: a substrate; a first conductive layer on the substrate; a first insulating layer on the first conductive layer; an active pattern on the first insulating layer and including a semiconductor material; a second insulating layer on the active pattern; and a second conductive layer on the second insulating layer, wherein the first insulating layer has a first opening exposing the first conductive layer, the second insulating layer has a second opening exposing the first conductive layer, a breadth of the first opening is different than a breadth of the second opening, and a side surface of the first opening and a side surface of the second opening are formed to a top surface of the first conductive layer.