Display Support Structure With Loop Heat Dissipation Cavity
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Solution Overview
Problem
Existing display devices face challenges in heat dissipation, particularly when running large-scale games or multiple software applications, leading to safety hazards and reduced reliability due to high temperatures, especially in flexible displays and chips.
Innovation Solution
A display device incorporating a loop heat dissipation cavity within the support component that overlaps with a heating element, utilizing a working fluid for phase change to dissipate heat, and featuring anti-backflow channels for unidirectional fluid flow to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an independent heat dissipation component is added to the display device, then heat dissipation performance is improved, but device thickness increases
Solution Approach 1:
The patent combines the heat dissipation function with the support component by integrating a loop heat dissipation cavity inside the support component. The support component simultaneously provides mechanical support for the display panel and houses the heat dissipation system, eliminating the need for separate independent heat dissipation components and thus avoiding increased device thickness.
Solution Approach 2:
The support component is designed to perform multiple functions: it provides structural support for the display panel and simultaneously serves as a heat dissipation device through the integrated loop heat dissipation cavity. This multi-functionality allows the same component to address both mechanical support requirements and thermal management needs without adding extra thickness.
2Length of stationary object
If the loop heat dissipation cavity is integrated inside the support component, then device thickness is reduced, but heat dissipation efficiency may be compromised
Solution Approach 1:
The loop heat dissipation cavity is configured to overlap with the heating element in the vertical dimension, allowing heat dissipation to occur directly beneath the heat source. This spatial arrangement ensures efficient heat transfer from the heating element to the working fluid in the cavity, maintaining high heat dissipation efficiency while keeping the device thin.
Solution Approach 2:
The heat dissipation system utilizes phase change of the working fluid (evaporation and condensation) within the loop heat dissipation cavity to achieve efficient heat transfer. The phase transition process absorbs and releases large amounts of latent heat, enabling effective heat dissipation within the constrained space of the integrated cavity.
3Temperature
If anti-backflow channels are added to the loop heat dissipation cavity, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The loop heat dissipation cavity is divided into multiple independent channels including evaporation channels, condensation channels, and anti-backflow channels. This segmentation allows the working fluid to flow in designated unidirectional paths, preventing circuit crosstalk and ensuring efficient heat transfer from evaporation to condensation zones without thermal interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated heat dissipation system reduces device thickness, improves heat dissipation efficiency, and minimizes issues like black spots and bright lines on the screen, while maintaining a lightweight and compact design.
Implementation Method 1
a working fluid located in the loop heat dissipation cavity
Implementation Method 2
the loop heat dissipation cavity including at least one anti-backflow channel
Implementation Method 3
a working fluid in the loop heat dissipation cavity of the support component also plays a heat dissipation role in the heat generated by the heating element through phase change
Implementation Method 4
the loop heat dissipation cavity includes at least one anti backflow channel, which is conducive to a unidirectional flow of the working fluid
Implementation Method 5
the heat generated by the heating element
Data Source
AI summary
A display device includes a display panel, a heating element located on a back side of a light-emitting surface of the display panel, and a support component located on the back side of the light-emitting surface of the display panel. The support component includes a loop heat dissipation cavity located inside the support component and a working fluid located in the loop heat dissipation chamber. A part of the loop heat dissipation cavity overlaps the heating element, and the loop type heat dissipation cavity includes at least one anti-backflow channel.