Integrated Display Panel Measurement Circuit for Crack and Bonding Resistance
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Solution Overview
Problem
Conventional display devices require separate circuits for crack measurement and bonding resistance measurement, leading to complex circuits and limited design flexibility, especially when manufacturing non-rectangular display panels.
Innovation Solution
An integrated measurement circuit that combines crack measurement and bonding resistance measurement functions, utilizing multiple wiring circuit units and pad portions to simplify the circuit and reduce bezel size, allowing for increased design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate crack measurement circuit and bonding resistance measurement circuit are used, then measurement functions are complete, but circuit complexity increases and bezel area increases
Solution Approach 1:
The patent combines the crack measurement circuit and bonding resistance measurement circuit into a single integrated measurement circuit. The wiring circuit units serve dual purposes: they function as crack measurement paths and simultaneously as bonding resistance measurement paths. This merging eliminates the need for separate circuits, reducing overall circuit complexity while maintaining both measurement functions.
Solution Approach 2:
The measurement circuit is designed with multi-functional wiring circuit units that can perform both crack detection and bonding resistance measurement. The same wiring structures, pad portions, and measurement paths are utilized for both measurement types, making the circuit universal and eliminating redundancy.
2Measurement precision
If separate measurement circuits are used, then measurement accuracy is maintained, but pad portion area and bezel size increase
Solution Approach 1:
The patent merges the pad portions required for crack measurement and bonding resistance measurement into a single shared pad structure. The first and second wiring circuit units both connect to the same pad portions, eliminating the need for separate pad areas. This reduces the overall pad portion area while maintaining the measurement accuracy of both functions through proper electrical connection paths.
3Adaptability or versatility
If multiple separate measurement circuits are implemented, then all measurement functions are available, but manufacturing process complexity increases
Solution Approach 1:
The patent integrates multiple measurement functions into a single circuit structure that can be manufactured as one unified component. The wiring circuit units, pad portions, and measurement paths are designed to serve multiple functions simultaneously, simplifying the manufacturing process by reducing the number of separate components that need to be fabricated, assembled, and tested.
Solution Approach 2:
The measurement circuit is designed with universal wiring structures that can perform both crack detection and bonding resistance measurement through the same physical pathways. This multi-functionality reduces manufacturing complexity by eliminating the need to produce and integrate separate dedicated circuits for each measurement type.
Data Source
AI summary
A display device includes a display panel including a display area and a non-display area, first and second wiring circuit units located in a first, a second, and a third non-display area, and a panel pad portion located in a fourth non-display area, the panel pad portion having a left panel pad portion and a right panel pad portion, in which the first/second wiring circuit unit has a wiring start point and a wiring end point located at a point close to the left/right panel pad portion, and the wiring start point/end point of the first wiring circuit unit is electrically connected to a pad portion included in the left/right panel pad portion, thus an effect of simplifying the circuit can be achieved by unifying the crack measurement circuit of the display panel and the bonding resistance measurement circuit between the display panel and the flexible circuit board into one integrated measurement circuit.