Multi-Layer Display Module Connection for Compact Devices

The patent applies dimensionality change by transitioning from a single-layer connection member to a multi-layer laminated structure. The first and second connection members are stacked in the vertical dimension, with conductive patterns on different layers that can be spaced apart vertically while maintaining compact horizontal footprint. This allows sufficient interval between conductive patterns without increasing the horizontal width, resolving the contradiction between reliability and mounting space.

The patent implements nesting by placing one connection member inside or adjacent to another in the vertical stacking arrangement. The first connection member with its conductive patterns is positioned in relation to the second connection member, creating a nested or layered configuration. This nested structure allows multiple conductive paths to coexist in a compact volume with adequate spacing between them, improving reliability without expanding the overall device area.

The patent resolves this contradiction by moving the spacing function to the vertical dimension through multi-layer stacking. Instead of increasing horizontal width to create interval between patterns, the invention stacks connection members vertically so that patterns on different layers are separated in the vertical direction. This maintains compact horizontal dimensions while ensuring sufficient interval between conductive patterns to prevent shorts from material elution, thereby improving connection durability.

The patent employs composite material principles by combining multiple connection members with different conductive patterns into a laminated structure. The first and second connection members form a composite assembly where each layer contributes specific conductive paths. This composite configuration allows optimized spacing between patterns across layers to prevent elution-induced shorts while maintaining overall compact dimensions.