Display Module Depression Structure for Thermal Management
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Solution Overview
Problem
Flexible OLED display panels experience reduced brightness and potential burning due to heat generated by driving chips, particularly affecting blue sub-pixels, leading to color cast and shortened service life.
Innovation Solution
A display module design incorporating a depression structure on the strengthening and supporting plates that reduces the actual contact area between them, thereby blocking heat conduction paths and enhancing heat dissipation, comprising grooves and holes arranged in specific directions to minimize heat transmission from driving chips to the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the driving chip is mounted on the lead-out portion to drive the display panel, then the display function is achieved, but heat generated by the driving chip causes reduced brightness and potential burning of the display panel
Solution Approach 1:
The supporting plate is divided into multiple sections by groove structures, creating separated regions that reduce direct thermal contact between the driving chip and the display panel while maintaining structural support functionality
Solution Approach 2:
The groove structures act as thermal intermediaries that interrupt heat conduction paths between the driving chip and the display panel, allowing mechanical support to be maintained while reducing thermal transfer
2Strength
If the supporting plate and strengthening plate are in full contact to provide structural support, then mechanical strength is improved, but heat conduction from driving chip to display panel increases
Solution Approach 1:
The supporting plate incorporates groove structures that segment the contact area between the supporting plate and strengthening plate, reducing the continuous contact area available for heat conduction while preserving necessary mechanical support through strategic contact points
Solution Approach 2:
The groove structures create localized regions of reduced contact area specifically in areas where heat conduction is problematic, while maintaining full contact in regions where mechanical support is critical, achieving differentiated functional optimization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces the impact of driving chip heat on the display panel, preventing burning and extending the service life while also addressing weight concerns by improving heat dissipation and structural strength.
Implementation Method 1
A display module design incorporating a depression structure on the strengthening and supporting plates that reduces the actual contact area between them, thereby blocking heat conduction paths and enhancing heat dissipation
Implementation Method 2
reduces the actual contact area between them, thereby blocking heat conduction paths and enhancing heat dissipation
Data Source
AI summary
A display module includes a display panel, at least one driving chip, a supporting plate and a strengthening plate. The display panel includes a display portion, a bending portion and a lead-out portion. The display portion has a display surface and a non-display surface. The at least one driving chip is mounted on a side of the lead-out portion away from the display portion. The supporting plate is located on the non-display surface of the display portion. The strengthening plate is located between the supporting plate and the lead-out portion. A depression structure is provided in at least one surface of two opposite surfaces of the strengthening plate and the supporting plate; an orthographic projection of the depression structure in the at least one surface on the lead-out portion at least partially overlaps with an orthographic projection of the at least one driving chip on the lead-out portion.