Cooling/Ventilation/Heating Modifications TRIZ Cases

One motor drives multiple fans via a linkage, reducing noise and energy consumption while maintaining cooling efficiency.

A relay circuit board directs cooling air to multiple units, reducing pressure loss and enhancing scalability.

Vertical micropins on a pin plate spray cooling fluid to generate turbulent flow, improving heat dissipation without complex nozzle systems.

A radiographic apparatus uses a heat transfer member to move thermal energy from electronic components to the casing.

Crosslinked polymer foam structures accommodate high filler loading to boost thermal conductivity while preventing cracking and shrinkage during manufacturing.

A talc-filled polypropylene housing connects to an aluminum heat sink via an elastomer layer that absorbs thermal expansion, preventing structural damage.

Offset shelf positions and angled hardware direct exhaust heat into a hot aisle, reducing energy consumption while preventing hot spots.

Segmented circuits maintain safe component temperatures while raising oil temperature for domestic hot water recovery.

Additive manufacturing merges the chassis and embedded cooling channels into a single unit, eliminating fasteners to reduce lead times and costs.

A vehicle controller cooling module uses a horizontal heat pipe and dual fans to transfer thermal energy from internal components.

A re-entrant cold plate design channels coolant fluid directly against electronic components to enhance heat transfer efficiency.

A chimney heat exchanger pre-cools heated air using a phase-changing working fluid to enhance thermal transfer efficiency.

Automated airflow balancing system adjusts fan speeds using real-time sensor data to maintain optimal cooling conditions.

Injection ducts deliver pressurized airflow to thermally challenged rear components, resolving inadequate cooling in densely packed server racks.

Air duct mounts fan and connector, preventing vibration wear on solder joints while simplifying assembly.

A display module integrates a heat dissipation layer with a stretchable structure to conform to curved panel edges.

Top-mounted fans in a side plenum direct airflow across horizontal modules, preserving PCB area limited by side-mounted cooling.

A liquid-cooled cold plate divides cooling liquid into branches flowing bidirectionally through microchannel groups to dissipate heat from electronic systems.

Depression structures on supporting plates reduce contact area to block heat conduction paths, preventing blue sub-pixel burning in flexible OLED displays.

A liquid-cooled integrated cabinet circulates coolant through cold plate shells to dissipate heat from computing power modules.

Modular in-row cooling units supplement existing infrastructure, resolving inadequate cooling capacity without expanding the datacenter footprint.

An outer shell containing a sensor prevents leakage damage while maintaining heat removal efficiency.

Embedded heat pipes move thermal energy away from semiconductor modules through phase change, reducing heat sink thickness and stray inductance.

A contained aisle design channels immersion cooling vapor to a dedicated return unit for condensation, preventing coolant loss and pollution.

Liquefied insulating gas circulates through heat exchangers to cool high-voltage components, eliminating water leakage risks in compact designs.

A flow plate partitions cabinet space to direct airflow across electrical components.

Integrated cooling plate with multi-channel flow paths dissipates heat from high-power components to prevent thermal failure.

Forced liquid coolant circulation through a pressure vessel prevents dry-out phenomena and enhances heat dissipation efficiency in microgravity environments.

Laser welding joins heat transfer portion tips to the cover plate, eliminating bulky joining members that increase thickness and reduce cooling efficiency.

A display assembly uses an isolated external air circulation structure to dissipate heat from backlight and sunlight radiation.

A universal heat sink receptacle in a line replaceable unit enclosure accommodates various COM Express modules and heat spreaders.

A hollow prismatic body filled with thermal conductive resin dissipates heat from vertical electronic components, solving fin incompatibility.

A fan tray assembly integrates a power supply unit to define air chambers for electronic circuit board cooling.

A thermal management system uses natural convection to move cool air through equipment and expel hot air without mechanical fans.

A cooling fluid supply apparatus uses bypass pipes and overheating prevention valves to route heat-dissipating fluid directly to the heat load.

Variable fin spacing reduces airflow resistance at the inlet while enhancing heat dissipation at the rear, solving uneven chip cooling in servers.

Layered casing with thermal paste channels coolant to reduce IC temperature without fan wear.

A fluid direction changing part alters airflow within a tubular heat sink to expose fin ends for intake.

Porous housing walls enable passive heat dissipation via thermal diffusion and convection while maintaining hermetic sealing against dust ingress.

A hybrid liquid cooling system uses a secondary loop to cool the primary coolant, reducing module temperature and simplifying installation.

Compressible porous sheets fill gaps between components, allowing coolant infiltration to lower thermal resistance and boost cooling performance.

Subcooled spray condenses vapor without liquid-cooled condensers, eliminating failure points and improving system reliability.

A liquid cooling cold plate uses stacked staggered convex plates to generate multidirectional turbulent flows within the flow channel.

A liquid cooling heat dissipation device uses cooled water flowing through connecting pipes to absorb thermal energy from electronic components.

A zigzag runner expands the fluid contact area on plate surfaces, reducing flow resistance while enhancing heat dissipation.

Segmenting the cooling fin from the heat sink resolves the contradiction between thin fin thickness and moldability, enabling efficient forced convection.

A cooling plate with microstructured surfaces increases effective heat transfer area and induces turbulence in the cooling medium flow.

A heat-curable silicone gel cures using component waste heat during operation.

Integrating fluid connectors into the manifold body eliminates welding steps that cause pipe wall thermal deformation and leakage.

A hybrid cooling system dynamically allocates air and liquid resources to manage electronic component temperatures.