Network Device Cooling with Relay Board Air Path
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Solution Overview
Problem
Conventional network communication devices with a front-back air supply and exhaust system face challenges in scalability and cooling efficiency, often requiring multiple cooling units and complex configurations, which can lead to increased pressure loss and reduced flexibility in maintaining and managing network connections.
Innovation Solution
A network communication device configuration where a relay circuit board is placed in the middle of the chassis, with the first circuit board unit in a horizontal direction in front and the cooling unit and second circuit board unit side by side behind, allowing for efficient air passage design that reduces pressure loss and enhances cooling efficiency using a single type of cooling unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple cooling units are used to cool each circuit board unit, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple cooling functions into a single cooling unit by positioning it to serve multiple circuit board units simultaneously. The cooling unit is placed on the back side of the relay circuit board, and air passages are designed to direct cooling air to different circuit board units, allowing one cooling unit to replace what would traditionally require multiple separate cooling units.
Solution Approach 2:
The single cooling unit is designed with multi-functionality to cool multiple different circuit board units. The air passage system enables the cooling unit to serve both the first circuit board unit (with intake air from front) and the second circuit board unit (with intake air from lateral sides), making the cooling unit universal for multiple cooling needs.
2Device complexity
If circuit board units are mounted vertically in the rack, then cooling is simplified, but scalability is reduced
Solution Approach 1:
The patent changes the mounting orientation of circuit board units from vertical to horizontal arrangement. The first circuit board unit is mounted horizontally on the front side of the relay circuit board, and the second circuit board unit is mounted horizontally on the back side. This dimensional change enables better scalability while maintaining effective cooling through the designed air passages.
3Temperature
If air passages are designed with multiple bends to reach cooling units, then cooling coverage is improved, but pressure loss increases
Solution Approach 1:
The air passages are designed to take preliminary direct paths from intake holes to cooling areas. The first air passage extends directly from the front side intake hole through the relay circuit board to the first cooling area. The second air passage extends directly from lateral intake holes through the relay circuit board to the second cooling area, avoiding unnecessary bends and reducing pressure loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency and scalability while simplifying the design, reducing pressure loss and allowing for flexible network management by optimizing air passage angles and cooling unit placement.
Implementation Method 1
a first cooling unit is placed in an upper part of the front side of the rack, a second cooling unit is placed on an upper side of the second circuit board unit, cooling air which has been introduced through a vent hole in a bottom of the front side of the rack, is introduced via the first circuit board unit to the first cooling unit and via the second circuit board unit to the second cooling unit
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3
AI summary
Cooling efficiency with simple configurations is enhanced when adopting the configuration of a front-back air supply and exhaust system as below. A first circuit board unit 120 is located in a horizontal direction in front of a relay circuit board 150 and a cooling unit 140 and a second circuit board unit 130 are placed side by side behind the relay circuit board 150 in a chassis 110 with the relay circuit board 150 placed between the first circuit board unit 120 and the cooling unit 140 and second circuit board unit 130; electric power is supplied from a power supply unit 180 via the relay circuit board 150 to each unit; a first air passage for allowing intake air introduced through an intake hole in a front side of the first circuit board unit 120 to pass through the first circuit board unit 120 and then introducing it through an opening in the relay circuit board 150 to the cooling unit 140 is formed in the chassis 110; a second air passage for allowing intake air introduced through an intake hole in a front face of the chassis 110 to pass through a lateral side of the first circuit board unit 120 and then introducing it through a vent hole in a partition provided at the lateral side of the first circuit board unit 120 to the cooling unit 140 is formed; and the second circuit board 130 is placed in the second air passage.