Re-entrant Cold Plate Direct Coolant Contact
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Solution Overview
Problem
Current thermal management systems for high-power electronic devices are limited by the need for thermally conductive materials, which increase weight and fail to efficiently manage thermal gradients between components of different power levels, and they rely on thermal interface materials that hinder performance.
Innovation Solution
A re-entrant cold plate design that allows coolant fluid to exit and re-enter the plate, directly contacting electronic components without a thermal interface material, enabling high-performance cooling and reducing the need for thermally conductive materials, thus minimizing weight and thermal gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermally conductive materials are used in cold plates, then heat transfer performance is improved, but weight increases
Solution Approach 1:
The patent extracts the thermal interface material from the system by creating a re-entrant cavity that allows direct fluid contact with the electronic component surface. This eliminates the thermal resistance layer without requiring heavier thermally conductive materials, as the coolant flows directly into the cavity space where heat transfer occurs most efficiently.
Solution Approach 2:
The invention transitions from traditional planar cold plate geometry to a three-dimensional re-entrant cavity structure. The cavity extends downward from the cold plate surface, creating a volumetric heat transfer zone that increases the effective heat transfer area without proportionally increasing the cold plate footprint or weight.
2Reliability
If thermal interface material is used between cold plate and component, then thermal contact is achieved, but thermal resistance increases
Solution Approach 1:
The patent completely removes the thermal interface material layer by designing a re-entrant cavity that exposes the electronic component surface directly to the coolant fluid. The cavity acts as the thermal interface, eliminating the additional thermal resistance that would be introduced by any interface material.
Solution Approach 2:
The re-entrant cavity serves as an intermediary structure between the cold plate and the electronic component. Instead of using thermal interface material as the mediator, the cavity filled with coolant fluid becomes the thermal coupling mechanism, providing superior thermal contact without the resistance inherent in solid interface materials.
3Ease of manufacture
If traditional cold plate design is used, then manufacturing simplicity is maintained, but thermal gradient control between components of different power levels is poor
Solution Approach 1:
The patent segments the cold plate into multiple independent re-entrant cavities, each tailored to specific high-power components. This segmentation allows customized cooling zones for different power levels while maintaining a standardized manufacturing process for the overall cold plate structure. Each cavity can be optimized independently for its specific thermal load.
Solution Approach 2:
The invention applies local quality by creating re-entrant cavities specifically at locations where high-power components are mounted. The cavity depth, volume, and positioning are locally optimized based on the specific thermal requirements of each component, while low-power areas maintain the traditional cold plate design, thus achieving precise thermal gradient control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat transfer efficiency, reduces thermal resistance, and allows for the use of lighter materials, effectively cooling high and low power components while minimizing thermal gradients and weight constraints.
Implementation Method 1
Heat from the components/assemblies is then conducted through the thermal interface material and cold plate material to ultimately be transferred to the coolant fluid
Implementation Method 2
Heat from the components/assemblies is then conducted through the thermal interface material and cold plate material to ultimately be transferred to the coolant fluid
Data Source
AI summary
A fluid-cooled re-entrant cold plate for thermal management of heat dissipating electronic devices or assemblies. The fluid leaves the cold plate's outer perimeter, fills a sealed cavity between the cold plate outer perimeter and the mating component/assembly, provides direct cooling of the electronic component, then re-enters the cold plate.