Server Heat Sink with Variable Fin Spacing
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Solution Overview
Problem
Existing heat sinks in servers exhibit insufficient heat dissipation performance at the rear due to high resistance to cold air flow, leading to inadequate cooling of chips, as the cold air flow is obstructed by the uniform size and arrangement of heat sinks along the airflow direction.
Innovation Solution
A heat dissipation device with a housing and multiple heat dissipation structures, including thermally conductive plates and fins, where the first heat dissipation structure is adjacent to the air inlet and the second structure is adjacent to the air outlet, with varying spacings between fins to enhance airflow and heat transfer, improving the overall heat dissipation efficiency by optimizing the airflow path and heat exchange areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are arranged in uniform size along the airflow direction, then the front heat sinks have sufficient heat dissipation performance, but the rear heat sinks have insufficient heat dissipation performance due to high airflow resistance
Solution Approach 1:
The patent applies local quality by making different heat sinks have different sizes according to their positions in the airflow path. Front heat sinks have smaller sizes while rear heat sinks have larger sizes, optimizing each location's heat dissipation capability based on local airflow conditions. This resolves the contradiction by adapting the heat sink properties to local requirements rather than using uniform sizes throughout.
Solution Approach 2:
The patent implements asymmetry by arranging heat sinks with non-uniform sizes along the airflow direction. The heat sink cross-sectional areas increase from front to rear, creating an asymmetric configuration that compensates for the decreasing airflow velocity and pressure along the flow path. This asymmetric arrangement ensures that rear heat sinks, which receive less airflow, have larger surface areas for effective heat dissipation.
2Temperature
If heat sinks are made larger to improve heat dissipation, then heat transfer area increases, but airflow resistance increases and cold air flow decreases
Solution Approach 1:
The patent applies local quality by varying heat sink sizes according to their specific positions in the airflow path. Rather than uniformly increasing all heat sink sizes, only rear heat sinks are made larger where the airflow velocity is naturally lower, while front heat sinks maintain smaller sizes to minimize airflow resistance. This localized adaptation resolves the contradiction between heat dissipation area and airflow velocity.
Solution Approach 2:
The patent addresses the contradiction by transitioning from a one-dimensional uniform size approach to a multi-dimensional variable size approach. Heat sink cross-sectional areas are adjusted in the lateral dimension based on their position along the airflow direction, creating a gradient distribution that optimizes both heat transfer area and airflow passage without requiring uniform size increases throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the heat dissipation effect of the second heat dissipation structure while maintaining the performance of the first, resulting in improved overall heat dissipation for the server, ensuring effective cooling of chips by optimizing airflow and heat transfer.
Implementation Method 1
a first heat dissipation structure (20a) adjacent to the air inlet (10b) and a second heat dissipation structure (20b) adjacent to the air outlet (10c
Implementation Method 2
a plurality of heat dissipation structures (20) disposed in the air passage (10a)
Data Source
AI summary
A heat dissipation device includes a housing with an air passage and air inlet and air outlet. The heat dissipation structures are in the air passage and include a first heat dissipation structure adjacent to the air inlet and a second heat dissipation structure adjacent to the air outlet. A projection of the first heat dissipation structure in the second heat dissipation structure along the first direction is within the second heat dissipation structure. The first and second heat dissipation structures each include a thermally conductive plate and gapped fins thereon disposed. A spacing of each gap in the first heat dissipation structure is greater than a spacing of each gap in the second heat dissipation structure.


