Hybrid Liquid Cooling System for Electronic Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current cooling systems for electronic modules, particularly in IT equipment, face challenges in efficiently managing heat as processing power increases and device size decreases, with air-cooled systems being inadequate and custom liquid cooling systems being complex and expensive.
Innovation Solution
A hybrid cooling system comprising two circulatory arrangements, where a first cooling circulatory arrangement cools electronic devices within an electronic module using a liquid coolant, and a second arrangement further cools the coolant through a heat exchanger, allowing for efficient heat transfer and targeted high-performance cooling of high-power components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling is used for electronic modules, then the system is simple and cost-effective, but the cooling efficiency is insufficient for high-power devices
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by circulating coolant through cold plates that contact electronic devices. The hydraulic system uses pumps and tubing to deliver coolant flow directly to heat-generating components, achieving superior heat removal efficiency while maintaining reasonable system complexity through standardized liquid cooling architecture.
2Temperature
If custom liquid cooling systems are implemented, then cooling efficiency improves, but system complexity and installation cost increase
Solution Approach 1:
The patent employs universal cold plate designs that can be standardized across different electronic device form factors and power levels. The modular approach allows the same basic cooling architecture to serve multiple applications, reducing overall system complexity while maintaining high cooling efficiency through proven liquid cooling technology.
Solution Approach 2:
The cooling system is divided into independent cold plates for different electronic devices, each with its own coolant flow path. This segmentation allows for targeted cooling of high-power components while simplifying the overall system design by breaking down the complex cooling requirement into manageable, standardized modules that can be independently optimized and installed.
3Device complexity
If single-loop cooling is used, then the system is simpler, but the ability to provide targeted high-performance cooling is reduced
Solution Approach 1:
The patent implements separate cooling loops or zones for different electronic devices within the enclosure. High-power devices receive dedicated coolant flow through individual cold plates, while lower-power devices share common cooling pathways. This segmentation enables targeted high-performance cooling where needed while maintaining system simplicity through standardized loop designs.
Solution Approach 2:
The cooling system provides different levels of cooling performance to different locations within the electronic module enclosure. High-power devices receive intensive cooling through directly-contact cold plates with high coolant flow rates, while other devices receive adequate cooling through shared pathways, optimizing overall system performance while managing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system provides enhanced cooling efficiency by utilizing a high-performance cooling loop to cool a lower-efficiency loop, maintaining a lower overall temperature within the module and allowing for more flexible and cost-effective installation, while reducing the risk of coolant leakage and exposure.
Implementation Method 1
Coolant circulating within the first cooling circulatory arrangement is cooled by transfer of heat, via a heat exchanger, to coolant circulating in the second cooling circulatory arrangement
Implementation Method 2
transfer of heat, via a heat exchanger
Data Source
AI summary
A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.