Monolithic Electronics Chassis with Embedded Multi-Planar Cooling
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Solution Overview
Problem
Traditional electronics chassis for high power electronics require long lead times and high costs due to complex manufacturing processes and extensive use of fasteners and fittings, making rapid reconfiguration and low-volume production challenging.
Innovation Solution
A monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels formed using additive manufacturing processes like Selective Laser Melting (SLM), which integrates cooling channels directly into the chassis structure, reducing the need for seams and fasteners and enabling complex thermal structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum-brazed cold walls with extensive fasteners and fittings are used, then structural integrity and cooling function are achieved, but manufacturing lead time increases and cost increases
Solution Approach 1:
The patent merges the cold wall structure, cooling channels, mounting rails, and support features into a single monolithic chassis component. This integration eliminates the need for multiple separate parts joined by fasteners and fittings, directly reducing manufacturing lead time while maintaining structural integrity through the unified additive manufacturing process.
Solution Approach 2:
The patent transitions from traditional vacuum-brazing manufacturing parameters to additive manufacturing parameters (layer-by-layer deposition, selective laser melting). This fundamental change in manufacturing parameters enables complex integrated geometries to be produced directly, eliminating assembly steps and reducing lead time while preserving structural properties.
2Reliability
If vacuum-brazed cold walls with extensive fasteners and fittings are used, then structural integrity and cooling function are achieved, but cost increases particularly for low volume manufacturing
Solution Approach 1:
The patent combines multiple discrete components (cold walls, cooling channels, mounting rails, support features) into a single monolithic structure. This merging eliminates the need for extensive fasteners, fittings, and assembly operations, directly reducing manufacturing cost especially for low-volume production where assembly labor represents a significant portion of total cost.
Solution Approach 2:
The patent replaces the mechanical assembly system (multiple parts joined by fasteners and fittings) with an additive manufacturing system that builds the structure layer-by-layer. This substitution eliminates the need for mechanical fastening operations and reduces the total number of parts, directly lowering manufacturing cost and complexity.
3Productivity
If traditional manufacturing processes are used, then chassis can be produced, but reconfiguration for new missions or system requirements becomes challenging
Solution Approach 1:
The patent enables dynamic adaptation of the chassis design through additive manufacturing. The monolithic structure can be rapidly re-designed and re-manufactured for new missions or system requirements by modifying the digital model and printing a new version, providing flexibility and adaptability that rigid traditional manufacturing processes cannot match.
Solution Approach 2:
The patent leverages the flexibility of additive manufacturing parameters to easily modify chassis geometry, cooling channel configurations, and mounting features for different applications. This parametric design capability allows rapid reconfiguration for new missions or system requirements without the constraints of traditional tooling and manufacturing processes.
4Ease of manufacture
If simple cooling channel configurations are used, then manufacturing is easier, but heat transfer efficiency decreases
Solution Approach 1:
The patent transitions from simple planar cooling channel configurations to complex three-dimensional multi-planar channels embedded within the monolithic chassis. This dimensional enhancement allows cooling channels to access multiple surfaces and optimize heat transfer paths without increasing manufacturing complexity, as the additive process naturally accommodates complex 3D geometries.
Solution Approach 2:
The patent employs curved and helical cooling channel configurations instead of straight linear paths. These curved geometries improve heat transfer efficiency by increasing surface area contact and optimizing fluid flow patterns, while the additive manufacturing process makes creating these complex curved paths as easy as defining straight channels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces lead times and costs, enhances heat transfer efficiency, and allows for rapid reconfiguration and improved reliability by eliminating leaks and enabling complex heat transfer shapes that traditional methods cannot achieve.
Implementation Method 1
the cooling fluid configured to absorb heat transferred from a heat source
Implementation Method 2
the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure
Implementation Method 3
the monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
A cooling system for cooling a heat source includes a monolithic structure (100) having a plurality of embedded cooling channels (220) arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process such as Selective Laser Melting (SLM) or Direct Metal Laser Sintering (DMLS).